Infrared Preheating for Thermocompression Bonding Resin Warping
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Solution Overview
Problem
The existing thermocompression bonding methods face challenges in preventing warping of resin members, especially those with low heat transfer coefficients and large thermal expansion coefficients, and in reducing the processing time for uniform heating.
Innovation Solution
The method employs infrared radiation for preheating resin members, ensuring uniform heating without reaching the melting point for crystalline resins or the glass transition point for noncrystalline resins, using an infrared lamp heater to prevent warping and expedite the thermocompression bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If a heated backup table is used for preheating the resin member, then the processing time is reduced and temperature distribution is improved, but warping occurs due to non-uniform heat distribution in the thickness direction
Solution Approach 1:
The patent transitions from one-dimensional heat transfer (contact heating from the backup table surface) to three-dimensional volumetric heating by introducing microwave irradiation that penetrates through the resin member, enabling uniform heating throughout the entire thickness without causing warping
Solution Approach 2:
The patent replaces the mechanical contact heating system (heated backup table) with an electromagnetic field-based heating system (microwave irradiation), which provides more uniform and controllable heat distribution throughout the resin member volume
2Manufacturing precision
If the resin member is heated to uniform temperature, then warping is prevented, but the heating time becomes excessively long
Solution Approach 1:
The patent achieves rapid three-dimensional volumetric heating through microwave irradiation that penetrates the resin member simultaneously from multiple depths, rather than relying on slow one-dimensional heat conduction from the surface, thus achieving temperature uniformity in much shorter time
Solution Approach 2:
The patent performs preliminary heating of the resin member to a temperature close to the bonding temperature before the actual thermocompression bonding process, so that when bonding begins, the heating time can be significantly reduced while maintaining temperature uniformity
3Device complexity
If contact heating is used for thick resin members, then the heating process is simple, but heat难以 reaches the center portion and warping occurs
Solution Approach 1:
The patent replaces the simple but ineffective mechanical contact heating system with a microwave heating system that provides superior heat distribution uniformity in thick resin members, with the added benefit that the microwave heating apparatus is already integrated into the bonding device
Solution Approach 2:
The patent introduces volumetric three-dimensional heating through microwave penetration, replacing the limited surface-to-center one-dimensional heat conduction of contact heating, thereby achieving uniform heat distribution throughout thick resin members
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents warping and reduces the time required for thermocompression bonding by ensuring uniform temperature distribution across the resin member, enhancing the efficiency of the bonding process.
Implementation Method 1
preheating a resin member (302), wherein the resin member is a chip component for use to manufacture a microfluidic chip using an infrared radiation section
Implementation Method 2
a resin material of the resin member having a melting point like a crystalline resin is heated not to reach the melting point, or a resin material of the resin member not having a melting point like a noncrystalline resin is heated not to reach the glass transition point
Implementation Method 3
subjecting the resin member to thermocompression bonding using a heating section and a pressurization section
Data Source
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AI summary
There are provided a method and device for thermocompression bonding of possibly preventing any warping of a resin member to be caused by thermocompression bonding, and of possibly reducing the time to be taken for processing. The method for thermocompression bonding, includes: preheating a resin member using an infrared radiation section; and subjecting the resin member to thermocompression bonding using a heating section and a pressurization section.