Infrared Receiver Chip Contact Area Positioning for Bond Wire Routing
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Solution Overview
Problem
Existing infrared receiver chips require different geometric arrangements to accommodate various standardized lead frames, leading to logistical challenges and increased costs due to the need for multiple designs with distinct transmission protocols.
Innovation Solution
An infrared receiver chip with contact areas positioned in a novel manner, allowing for direct and non-intersecting bond wires when installed in any of the three standardized lead frames, by displacing contact areas from the edge towards the center, ensuring all bond wires are as short as possible and do not intersect.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple different designs of infrared receiver chips are used to accommodate different standardized lead frames, then the bond wires can be kept short and non-intersecting for each specific lead frame design, but the device complexity and logistical management become significantly increased
Solution Approach 1:
The patent applies universality by designing a single infrared receiver chip with contact areas positioned at specific locations that can accommodate multiple standardized lead frame designs (first, second, and third designs). The contact areas are arranged such that regardless of which lead frame design is used, the bond wires connecting the contact areas to the connection points remain short and non-intersecting. This allows one chip design to serve multiple functions across different lead frame configurations, eliminating the need for multiple specialized chip designs.
2Ease of operation
If contact areas are positioned at the edge of the chip for easy connection, then the connection to lead frame points is simplified, but the bond wires may become longer and intersect, causing electromagnetic interference
Solution Approach 1:
The patent applies local quality by positioning the contact areas at specific locations on the chip surface that are optimized for each connection type. The contact areas are not uniformly placed at the edges nor at the center, but at specific positions that balance connection simplicity with bond wire optimization. This localized positioning ensures that bond wires remain short and non-intersecting while still providing easy connection to the lead frame, thus reducing electromagnetic interference without sacrificing ease of operation.
3Device complexity
If a single uniform infrared receiver chip design is used for all standardized lead frames, then logistical complexity is reduced, but it becomes difficult to ensure short non-intersecting bond wires for all lead frame configurations
Solution Approach 1:
The patent applies asymmetry by positioning the contact areas in an asymmetric arrangement on the chip surface. The contact areas are located at specific asymmetric positions relative to the chip center and edges, which allows the same chip design to work with multiple different lead frame configurations. This asymmetric positioning ensures that regardless of how the chip is oriented or which lead frame design is used, the bond wires can be routed short and non-intersecting, maintaining reliability while using a single uniform chip design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows a single uniform infrared receiver chip to be installed in multiple lead frames, reducing logistical complexity and costs while maintaining efficient electromagnetic interference minimization.
Implementation Method 1
the received light signals are converted to electrical signals
Data Source
AI summary
An infrared receiver chip is provided for installation in a standardized lead frame of an infrared receiver module having multiple contact areas for connection of associated function points of the lead frame via bond wires, wherein at least one contact area is spaced apart from the outer edge of the infrared receiver chip and all contact areas are positioned with respect to one another such that, when the infrared receiver chip is installed in any standardized lead frame, the respective bond wires do not cross when the bond wires are routed directly from the associated contact area to the associated function point.