Infrared-Responsive Release Layer for Laminate Separation

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Solution Overview

Problem

Existing methods for preparing laminates fail to prevent substrate damage during the separation of substrates and supports, particularly due to the use of blades that contact the substrate, leading to damage and lack of effective support separation technologies.

Innovation Solution

A method involving the formation of a release layer on the periphery of the support using reactive polysilsesquioxane, which can be altered by infrared radiation, and a first adhesive layer containing a release agent to laminate the substrate and support, allowing for successful separation without damaging the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a blade is inserted into the adhesive layer to separate the substrate and support, then the separation can be achieved, but the substrate is damaged due to blade contact

Engineering Contradiction:

Improveseparation successVSAvoidsubstrate damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A release layer is introduced as an intermediary between the substrate and the adhesive layer. This release layer has controlled adhesion properties that allow it to fail preferentially during separation, protecting the substrate from direct contact with the separation blade while still enabling successful separation of the support

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The release layer is formed on the substrate surface before the adhesive layer is applied. This preliminary protective layer is designed with specific adhesion characteristics that prevent substrate damage during subsequent separation operations

Inventive Principle:

Principle #10Preliminary action

2Strength

If the adhesive layer is made stronger to prevent substrate damage during handling, then the substrate is better protected, but the separation process becomes more difficult

Engineering Contradiction:

Improveadhesive bond strengthVSAvoidseparation ease

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The bonding interface is segmented into two distinct layers: an adhesive layer for strong bonding and a release layer for controlled separation. The release layer acts as a sacrificial element that segments the stress during separation, allowing strong adhesion while enabling easy separation

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The release layer's adhesion parameters are specifically controlled to be weaker than the adhesive layer but sufficient for handling. By changing the adhesion parameter of the release layer, the system achieves both strong overall bonding and easy separation

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method effectively prevents substrate damage during separation by altering the release layer's adhesiveness, enabling the substrate and support to be separated without applying excessive force, thus maintaining the integrity of the substrate.

Implementation Method 1

a release layer capable of being altered by irradiation with infrared ray is provided on one surface of the surface of the substrate and the surface of the support which face each other

Methodology Applied

Scientific EffectInfrared radiation absorption: Absorption (EM radiation)

Data Source

PatentUS10081172B2Method of preparing laminate, and method of separating support

Publication Date: 2018.09.25 TOKYO OHKA KOGYO CO LTD

AI summary

A method of preparing a laminate, in which the laminate has a substrate and a support plate, and is provided with a release layer capable of being altered by irradiation with infrared ray, the method including forming the release layer on only a periphery of one of the substrate and the support plate; and laminating the substrate and the support plate through the release layer and a first adhesive layer.