Infrared Temperature Sensor Cascading and Thermal Compensation
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Solution Overview
Problem
Infrared temperature sensors face challenges in efficiently addressing multiple sensors in a single bus, leading to increased costs and measurement inaccuracies due to limited space and ambient temperature variations, particularly in applications like electric vehicle batteries and server data centers.
Innovation Solution
The solution involves cascading infrared temperature sensors through a second communication port, allowing an external host controller to assign addresses and incorporating a second thermopile sensing element to compensate for measurement errors caused by package structure temperature variations, enhancing accuracy and simplifying administration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple infrared temperature sensors are used to monitor narrow spaces, then measurement coverage is improved, but device complexity and cost increase
Solution Approach 1:
The patent divides the monitoring task into multiple sensor units, each capable of independent operation. Each sensor segment can monitor a specific zone, and multiple segments work together to cover the entire narrow space, resolving the contradiction between coverage area and device complexity
Solution Approach 2:
The patent implements a hierarchical address structure where sensors are organized in groups with group addresses and individual sensor addresses. This nested addressing system allows multiple sensors to be managed efficiently through a single bus, reducing the complexity of managing multiple independent sensors while maintaining comprehensive coverage
2Ease of operation
If specific addresses are preloaded into non-volatile memories of sensors, then address administration is simplified, but address conflict occurs in field installation
Solution Approach 1:
The patent implements a dynamic address assignment system where sensor addresses are not fixed but can be configured and modified during field installation. The host controller can dynamically assign addresses to sensors based on the specific application requirements, eliminating address conflicts while maintaining ease of administration
Solution Approach 2:
The patent allows address parameters to be changed and reconfigured after installation. The sensing system supports address reassignment through the communication bus, enabling flexible parameter adjustment to avoid conflicts without requiring hardware changes or complex administration procedures
3Adaptability or versatility
If external jumpers are used to provide addresses to sensors, then address flexibility is improved, but device volume and I/O port requirements increase
Solution Approach 1:
The patent replaces the mechanical jumper-based address selection system with an electronic communication bus system. Addresses are transmitted and configured through digital signals on the bus, eliminating the need for physical jumpers and reducing device volume while maintaining address flexibility
Solution Approach 2:
The communication bus serves multiple functions: it transmits temperature data, assigns addresses, and enables sensor configuration. This multi-functional approach eliminates the need for separate address selection mechanisms like jumpers, reducing overall device complexity and volume while maintaining versatility
4Adaptability or versatility
If infrared temperature sensors are used in varying ambient temperature environments, then application versatility is improved, but measurement precision deteriorates
Solution Approach 1:
The patent implements a feedback mechanism where the sensor system continuously monitors ambient temperature and uses this information to compensate for measurement errors. The host controller receives feedback about environmental conditions and adjusts measurements accordingly, maintaining precision across varying temperature environments
Solution Approach 2:
The patent applies preliminary compensation for temperature variations by measuring ambient conditions and pre-adjusting measurement parameters before actual temperature measurements are taken. This anticipatory approach counteracts the effects of environmental temperature changes, maintaining measurement precision despite environmental variability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies address administration, reduces costs, and improves measurement accuracy by enabling efficient communication and calibration across multiple sensors, even in harsh environments.
Implementation Method 1
The first thermopile sensing element is corresponding to the window, and configured for receiving a first infrared light beam from the exterior and generating a first sensation signal
Implementation Method 2
The second thermopile sensing element is corresponding to the shield member, and configured for receiving a second infrared light beam radiated by the shield member and generating a second sensation signal
Implementation Method 3
The infrared sensing chip includes at least one first thermopile sensing element and a second thermopile sensing element
Data Source
AI summary
An infrared temperature sensor comprises a first communication port and a second communication port. A plurality of infrared temperature sensors can be cascaded to each other and connected to an external host controller through the second communication port. The external host controller can set up and administer the unique addresses of the plurality of the infrared temperature sensors through the second communication port, whereby to selectively perform multicasting communication or unicasting communication with the plurality of infrared temperature sensors through the first communication port. The infrared temperature sensor further comprises a second thermopile sensing element used to sense the thermal radiation of a package structure, whereby to compensate for the measurement error induced by temperature variation of the package structure. Thus, the measurement accuracy is increased.