Infrared Sensor Chip Heating for Precise Temperature Control
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Solution Overview
Problem
Conventional infrared sensor devices face challenges in precisely controlling the temperature of the sensor chip due to the Peltier element being a separate member, which hinders accurate measurement.
Innovation Solution
An infrared sensor device with an integrated heat generation mechanism on the insulating substrate, controlled by a control unit to manage current supply, ensuring precise temperature regulation of the sensor chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a Peltier element is used for temperature control, then temperature control capability is provided, but measurement accuracy is insufficient due to imprecise temperature control
Solution Approach 1:
The heating element is integrated directly into the sensor chip structure, merging the temperature control function with the sensing element. This integration eliminates the gap between the Peltier element and sensor chip, enabling precise temperature control at the exact location where temperature stability is critical for measurement accuracy.
2Device complexity
If a separate Peltier element is attached to the sensor chip, then temperature control is achieved, but temperature control precision is insufficient
Solution Approach 1:
The heating element is formed as an integrated part of the sensor chip rather than as a separate attached component. This merging eliminates thermal interface resistance and ensures that temperature control is applied precisely where needed, achieving superior temperature control precision.
Solution Approach 2:
The heating element is positioned specifically at the region of the sensor chip that requires temperature control, providing localized heating capability. This local quality approach ensures that temperature is controlled precisely at the critical sensing region without affecting other parts of the device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration allows for precise temperature control of the sensor chip, enhancing measurement accuracy and stabilizing output levels quickly.
Implementation Method 1
a heat generation mechanism integrated with the sensor chip; and a control unit provided on the insulating substrate and controlling an amount of current to be supplied to the heat generation mechanism
Data Source
AI summary
A sensor chip (4) having a pixel unit (8) that detects an infrared ray is bonded to an insulating substrate (2) using a bonding material (3). A heat generation mechanism (11) is integrated with the sensor chip (4). A control unit (14) is provided on the insulating substrate (2) and controls an amount of current to be supplied to the heat generation mechanism (11).