Integrated Infrared Sensor IC with Autofocusing and Stabilization

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Solution Overview

Problem

There is a growing need for portable, compact, and power-efficient infrared camera systems for civilian applications such as vehicle vision assistive devices and security cameras, which current technologies have not adequately addressed in terms of size and power consumption.

Innovation Solution

An infrared image sensor and camera module design featuring a first integrated circuit (IC) with a bolometer for infrared detection, a reflective layer, and a driver for autofocusing and optical image stabilization, allowing for efficient processing and stabilization of infrared images, and potentially including a second IC for enhanced image processing and output.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple separate ICs are used for different processing functions, then functional reliability is improved, but device size and complexity increase

Engineering Contradiction:

Improvefunctional reliabilityVSAvoiddevice complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple previously separate ICs (RO element IC, ISP element IC, AF control IC, OIS control IC) into a single integrated IC. This integration maintains all necessary processing functions while reducing the overall device size and component count, directly resolving the contradiction between reliability and complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated IC is designed to perform multiple functions simultaneously: infrared signal readout, analog-to-digital conversion, image processing, autofocusing control, and optical image stabilization control. This multi-functional design eliminates the need for separate dedicated ICs while maintaining comprehensive functionality.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple separate ICs are used for different processing functions, then functional completeness is improved, but manufacturing cost increases

Engineering Contradiction:

Improvefunctional completenessVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

By merging multiple functional ICs into one integrated IC, the patent reduces the total number of components that need to be manufactured, assembled, and tested. This integration simplifies the manufacturing process and reduces assembly costs while maintaining complete functional capabilities.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated IC internally segments different processing functions into distinct functional blocks (RO element, ISP element, AF control element, OIS control element), allowing each function to be optimized independently while sharing common infrastructure such as power supply and signal routing, thereby reducing overall manufacturing complexity.

Inventive Principle:

Principle #1Segmentation

3Volume of moving object

If a compact sensor design is implemented, then device size is reduced, but thermal management becomes more challenging

Engineering Contradiction:

Improvesensor sizeVSAvoidthermal management

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The patent employs a stacked three-dimensional architecture where different functional layers (bolometer layer, IC layer, lens layer) are arranged vertically. This vertical stacking reduces the horizontal footprint of the sensor while distributing heat-generating components across multiple layers, improving thermal dissipation pathways and addressing thermal management challenges in compact designs.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design achieves clearer infrared image information with reduced size and cost, enabling efficient infrared image capture and stabilization, suitable for portable and civilian applications.

Implementation Method 1

a bolometer disposed on or above one surface of the first IC configured to detect infrared rays passing through a lens module

Methodology Applied

Scientific EffectInfrared radiation detection: Absorption (EM radiation)

Implementation Method 2

a reflective layer disposed between the first IC and the bolometer

Methodology Applied

Scientific EffectReflection: Reflection

Data Source

PatentUS11575845B2Infrared image sensor and infrared camera module

Publication Date: 2023.02.07 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

An infrared image sensor includes a first integrate circuit (IC), a bolometer disposed on or above one surface of the first IC configured to detect infrared rays passing through a lens module, a via electrically connecting the first IC and the bolometer, and a reflective layer disposed between the first IC and the bolometer, wherein the first IC includes at least one of a read-out (RO) element configured to perform analog processing for the bolometer to generate infrared sensing information and an image signal process (ISP) element configured to perform digital processing based on the bolometer to generate infrared image information, and at least one of an autofocusing (AF) control element and an optical image stabilization (OIS) control element configured to adjust a positional relationship between the lens module and the bolometer.