Infrared Sensor Lens Integrating Filter and Getter Activation

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Solution Overview

Problem

Conventional infrared sensors require complex packaging procedures and high costs due to the need for a vacuum chamber, getter activation at high temperatures, and the inclusion of an infrared filter and lens.

Innovation Solution

An infrared sensor design that integrates an infrared lens with the sensor, forming a vacuum chamber with a substrate and metal cover, and using the infrared lens for both filtering and focusing, thus eliminating the need for a separate infrared filter and simplifying the packaging process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a separate infrared filter and lens are used, then the infrared sensor can effectively filter and focus infrared light, but the cost and volume of the infrared sensor increase

Engineering Contradiction:
Improveinfrared light filtering and focusing capabilityVSAvoidnumber of components
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the infrared filter and lens into a single integrated component. The lens is designed with an infrared reflective layer that provides both focusing and filtering functions simultaneously, eliminating the need for separate filter and lens components while maintaining optical performance

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The lens is designed to perform multiple functions: it focuses infrared light onto the sensing chip while simultaneously filtering out non-infrared wavelengths through its infrared reflective layer. This multi-functional design reduces the overall component count while maintaining system effectiveness

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If a vacuum chamber with getter is used to improve infrared sensing chip sensitivity, then the service life of the infrared sensor increases, but the packaging procedures become more complicated and costly

Engineering Contradiction:
Improvesensitivity of infrared sensing chipVSAvoidpackaging procedures
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent integrates the getter directly into the packaging structure of the infrared sensor, combining the vacuum maintenance function with the housing. This integration eliminates the need for separate getter activation procedures and simplifies the packaging process while maintaining the vacuum environment necessary for high sensitivity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The getter is designed to automatically activate and maintain the vacuum environment without requiring external activation equipment or complex procedural steps. The packaging structure itself facilitates the getter's operation, making the system self-sufficient in maintaining vacuum conditions

Inventive Principle:
Principle #25Self-service

3Reliability

If the getter is activated at high temperature exceeding 300°C, then the getter can effectively maintain vacuum pressure, but the infrared sensing chip and anti-reflection layer may be damaged

Engineering Contradiction:
Improvevacuum pressure maintenance capabilityVSAvoidhigh temperature damage to sensitive components
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent separates the getter activation process from the sensitive infrared components by using spatial segmentation and temporal sequencing. The getter is positioned and activated in a way that isolates it from the infrared sensing chip and anti-reflection layer, allowing high-temperature activation without damaging the heat-sensitive components

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The getter is pre-positioned and prepared in the packaging structure before final assembly with the sensitive infrared components. This preliminary arrangement allows for controlled activation procedures that protect the infrared sensing chip and anti-reflection layer from high temperature exposure while still achieving effective vacuum maintenance

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces packaging complexity and costs by eliminating the need for a separate infrared filter and simplifying the activation of the getter, while maintaining the sensitivity and image quality of the infrared sensor.

Implementation Method 1

The lens can focus infrared light to the infrared sensing chip to generate clear pictures

Methodology Applied
Scientific EffectFocusing: Focusing

Implementation Method 2

The infrared lens has an infrared filtering function

Methodology Applied
Scientific EffectInfrared filtering: Filter (optical)

Implementation Method 3

The temperature generated by a fact that the metal cover is soldered to the substrate can activate the getter

Methodology Applied
Scientific EffectSoldering: Soldering

Implementation Method 4

the activation temperature of the getter exceeds 300° C.

Methodology Applied
Scientific EffectActivation:

Implementation Method 5

The vacuum chamber can be used to improve the sensitivity of the infrared sensing chip

Methodology Applied
Scientific EffectVacuum: Vacuum

Implementation Method 6

The vacuum chamber accommodates a getter for maintaining the vacuum pressure of the vacuum chamber for a long time

Methodology Applied
Scientific EffectGetter: Gettering

Data Source

PatentUS12270709B2Infrared sensor
Publication Date: 2025.04.08 TXC CORP
  • US12270709B2 patent drawing
  • US12270709B2 patent drawing
  • US12270709B2 patent drawing

AI summary

An infrared sensor uses an infrared lens with infrared filtering and focusing functions. Thus, an infrared filter can be omitted to reduce the costs and volume. In addition, a getter on the inside of a metal cover of the infrared sensor can be activated when the metal cover is soldered to the substrate of the infrared sensor. Therefore, the packaging process of the infrared sensor can be simplified.