Infrared Sensor Module Thermal Conductor Seal Integration
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Solution Overview
Problem
Conventional infrared sensor modules face challenges in achieving compact size and high accuracy due to thermal coupling issues between the metal layer, optical members, and signal processor, which hinder effective thermal isolation and increase the risk of receiving unwanted infrared radiation.
Innovation Solution
The infrared sensor module incorporates a quantum infrared sensor, a signal processor, a thermal conductor with higher thermal conductivity than resin, and a seal that exposes the light-receiving surface and thermal conductor, allowing for thermal coupling with an optical member to limit the field of view and reduce module size by positioning the thermal conductor and optical member in contact without needing to be outside the signal processor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal layer is provided on the substrate to surround the field of view limiting portion and increase thermal conduction, then thermal coupling between the infrared sensor and optical member is improved, but the module size increases because the optical member and metal layer need to be placed in contact outside the signal processor
Solution Approach 1:
The thermal conductor is integrated into the seal structure, merging the thermal conduction function with the sealing function. The thermal conductor forms a leg-shaped structure that is part of the seal, eliminating the need for separate external metal layers and optical member placement, thereby reducing module size while maintaining thermal coupling.
Solution Approach 2:
The thermal conductor acts as an intermediary element that establishes thermal coupling between the infrared sensor and the signal processor without requiring direct contact between the optical member and metal layer outside the signal processor. The thermal conductor leg structure mediates the thermal path through the seal interior.
2Measurement precision
If thermal isolation from the outside is implemented, then measurement accuracy is improved by reducing unwanted infrared radiation, but the device complexity increases due to additional thermal management structures
Solution Approach 1:
The seal structure serves multiple functions simultaneously: it provides thermal isolation from the outside environment, mechanical support for the infrared sensor and signal processor, and incorporates the thermal conductor for thermal coupling. This multi-functionality reduces device complexity while maintaining measurement precision.
Solution Approach 2:
The thermal conductor is strategically positioned to provide thermal coupling only at specific locations where needed (between the infrared sensor and signal processor), while the rest of the seal provides thermal isolation. This localized approach to thermal management reduces overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a compact and highly accurate infrared detection system by minimizing thermal conduction paths and reducing unwanted radiation interference, thereby enhancing measurement precision and module miniaturization.
Implementation Method 1
a thermal conductor in contact with the signal processor and disposed at a different position than the quantum infrared sensor in plan view
Implementation Method 2
a quantum infrared sensor configured to detect light in an infrared region
Implementation Method 3
a seal configured to seal the quantum infrared sensor, the signal processor, and the thermal conductor integrally
Data Source
AI summary
This infrared sensor module is compact and capable of highly accurate infrared detection. The infrared sensor module (10) includes a quantum infrared sensor (11) configured to detect light in an infrared region, a signal processor (21) electrically connected to the quantum infrared sensor, a thermal conductor (15) in contact with the signal processor and disposed at a different position than the quantum infrared sensor in plan view, and a seal (14) configured to seal the quantum infrared sensor, the signal processor, and the thermal conductor integrally. A light-receiving surface of the quantum infrared sensor and a portion of the thermal conductor are exposed from the seal, and the thermal conductor is configured by a material with higher thermal conductivity than resin.