Infrared Temperature Sensor for Solder Paste Cartridge
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Solution Overview
Problem
In surface-mount circuit board manufacturing, the temperature of solder paste is often unknown when it is first installed or replenished in a stencil printer, which can affect print release characteristics and quality, as existing systems only heat the material after it leaves the packaging and do not utilize temperature information for alignment or deposition control.
Innovation Solution
A non-contact infrared temperature probe is mounted to measure the temperature of the material supply cartridge, ensuring it reaches a desired temperature range before deposition, and can also monitor the substrate temperature for precise alignment and optimization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heater and cooler with feedback mechanism are used to stabilize paste temperature, then temperature control is improved, but the system complexity increases and temperature information is not utilized for alignment or deposition control
Solution Approach 1:
The temperature sensor serves multiple functions: it monitors paste temperature for control purposes, provides temperature data for alignment optimization, and enables deposition parameter adjustment. This multi-functionality resolves the contradiction by maximizing the utility of the temperature measurement infrastructure without proportionally increasing system complexity.
Solution Approach 2:
The patent implements feedback mechanisms where temperature sensor data is fed back to adjust deposition parameters and alignment settings in real-time. This creates a closed-loop system that automatically optimizes printing based on actual material temperature, eliminating the need for complex manual control while improving both temperature stabilization and process optimization.
2Manufacturing precision
If temperature measurement is implemented before deposition, then print quality is improved, but additional measurement equipment and processing time are required
Solution Approach 1:
The temperature sensor is integrated into the existing material handling system and serves multiple purposes: quality control through temperature verification, process optimization for alignment, and deposition parameter adjustment. This multi-functional approach justifies the added measurement capability by providing multiple benefits from a single equipment addition.
Solution Approach 2:
Temperature measurement is performed before deposition and alignment operations, allowing the system to pre-determine optimal parameters based on material temperature. This preliminary action enables proactive adjustment of printing parameters rather than reactive correction, improving print quality while streamlining the overall process flow.
3Productivity
If temperature information is used for alignment and deposition control, then printing efficiency is improved, but the complexity of utilizing temperature data increases
Solution Approach 1:
The system implements automated feedback loops where temperature sensor data directly influences alignment and deposition control parameters. The controller automatically adjusts printing parameters based on real-time temperature readings, eliminating manual intervention and complex data analysis while improving printing efficiency through dynamic optimization.
Solution Approach 2:
The printing system performs self-adjustment based on temperature information, with the controller automatically modifying alignment and deposition parameters without requiring external analysis or manual intervention. This self-service capability simplifies the utilization of temperature data while maintaining high printing efficiency through automated real-time optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures that both the solder paste and substrate are at the correct temperatures before deposition, improving print quality and efficiency by preventing unnecessary delays and ensuring consistent material properties.
Implementation Method 1
A non-contact infrared temperature probe is mounted to measure the temperature of the material supply cartridge
Data Source
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AI summary
A print head assembly (20) of a stencil printer (10) includes a print head frame (36) and a wiper blade assembly (74) coupled to the print head frame. The wiper blade assembly includes wiper blades (78) that contact the stencil (18) to print solder paste onto the stencil during a print stroke. The wiper blades (78) are configured to force solder paste through the apertures of the stencil (18). The print head assembly (20) further includes a dispensing unit (56) coupled to the print head frame (36). The dispensing unit (56) is disposed between the wiper blades (78) to deposit solder paste between the wiper blades. The dispensing unit includes a cartridge receiver (66). The print head assembly (20) further includes a cartridge (68) positioned in the cartridge receiver (66) and a sensor (80) coupled to the print head frame (36) proximate the cartridge (68). The sensor (80) is configured to measure a temperature of the cartridge (68).