Infrared Sensor Pixel Architecture for High Resolution
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Solution Overview
Problem
Current infrared sensors face limitations in achieving high resolution while maintaining a compact size, as the number of pixels increases, requiring a reduction in pixel pitch to improve resolution and sensitivity, but this is challenging with existing technologies.
Innovation Solution
The development of an infrared sensor module with a plurality of pixels arranged in close proximity on a substrate, utilizing a pair of support structures, a thermally conductive resistive layer, and reflective layers to enhance sensitivity and reduce pixel pitch to 10 microns or less, allowing for higher resolution imaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the number of pixels in an infrared sensor is increased to improve resolution, then the resolution improves, but the size of the sensor increases
Solution Approach 1:
The patent employs a thin membrane structure that suspends the infrared absorptive material above the substrate, allowing the pixel elements to be compact while maintaining their detection function. This thin-film approach enables high pixel density without proportionally increasing the overall sensor footprint, directly resolving the contradiction between resolution and sensor size.
Solution Approach 2:
The patent utilizes vertical layering with the membrane structure to create three-dimensional space utilization. By stacking functional layers (substrate, reflector, membrane, absorptive material) vertically, the design achieves high resolution in a compact planar footprint, effectively adding a vertical dimension to solve the area constraint.
2Measurement precision
If the pixel pitch is reduced to improve resolution and sensitivity, then the resolution and sensitivity improve, but the manufacturing difficulty increases
Solution Approach 1:
The patent divides the sensor into discrete pixel elements, each with its own reflector and membrane structure. This segmentation allows for standardized fabrication processes that can be replicated across the array, making reduced pixel pitch more manufacturable through modular assembly and batch processing techniques.
Solution Approach 2:
The patent changes the physical parameters of the pixel structure, particularly the pitch distance between pixels, to achieve higher resolution. By systematically varying these parameters during fabrication and using the membrane suspension technique, the design maintains manufacturability even at reduced pitch dimensions.
3Measurement precision
If the pixel pitch is reduced to improve sensitivity, then the sensitivity improves, but the thermal isolation between pixels becomes more challenging
Solution Approach 1:
The patent extracts the thermal conduction path by suspending the infrared absorptive material on a membrane above the substrate, removing direct thermal contact between adjacent pixels. This extraction of the thermal coupling path enables better thermal isolation even when pixels are positioned closer together, maintaining sensitivity without increased thermal crosstalk.
Solution Approach 2:
The membrane acts as an intermediary element between the infrared absorptive material and the substrate, providing mechanical support while minimizing thermal conduction. This intermediary structure enables reduced pixel pitch while maintaining thermal isolation, as the membrane material can be selected for low thermal conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the creation of high-resolution infrared sensors with increased sensitivity and specificity, expanding their applications, particularly in automotive safety and energy efficiency, by improving the detection of temperature variations and radiation patterns.
Implementation Method 1
an infrared absorption layer on the second infrared reflector layer
Implementation Method 2
a thermally conductive resistive layer on the membrane and positioned above the first infrared reflector layer
Implementation Method 3
a membrane formed on the first and second support structures
Data Source
AI summary
The present disclosure is directed to an infrared sensor that includes a plurality of pairs of support structures positioned on the substrate, each pair including a first support structure adjacent to a second support structure. The sensor includes plurality of pixels, where each pixel is associated with one of the pairs of support structures. Each pixel includes a first infrared reflector layer on the substrate between the first and the second support structures, a membrane formed on the first and second support structures, a thermally conductive resistive layer on the membrane and positioned above the first infrared reflector layer, a second infrared reflector layer on the resistive layer, and an infrared absorption layer on the second infrared reflector layer.