Infrared Sensor Sealing Frame With Integrated Electrical Connection
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Solution Overview
Problem
The separate processes of sealing the aperture and electrical connection between the substrate and signal processing circuit portion in infrared sensors increase manufacturing costs.
Innovation Solution
An infrared sensor design that integrates a sealing frame and first connection to hermetically seal an internal space between two semiconductor substrates, allowing simultaneous sealing and electrical connection, reducing manufacturing complexity and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate and signal processing circuit portion are hermetically sealed by the sealing material after electrical connection, then the internal space is sealed to maintain vacuum and thermal insulation, but the manufacturing process becomes complex and costly due to separate sealing and connection steps
Solution Approach 1:
The patent combines the sealing frame and connection wiring into a single integrated component. The sealing frame includes both the sealing portion that hermetically seals the internal space and the connection portion that electrically connects the infrared detection element to the signal processing circuit. This integration eliminates the need for separate sealing and connection steps, reducing manufacturing complexity while maintaining reliable hermetic sealing.
Solution Approach 2:
The sealing frame serves multiple functions simultaneously: it provides hermetic sealing to maintain the vacuum state in the internal space, provides electrical connection between the infrared detection element and signal processing circuit, and provides structural support. This multi-functionality reduces the number of components needed and simplifies the manufacturing process.
2Reliability
If separate sealing material and connection wiring are used, then the internal space can be sealed and electrical connection can be established, but the manufacturing cost increases due to multiple materials and steps
Solution Approach 1:
The patent merges the sealing function and electrical connection function into a single sealing frame component. The sealing portion and connection portion are formed as an integrated structure, eliminating the need for separate sealing material and connection wiring. This reduces material costs and simplifies the manufacturing process while ensuring reliable electrical connection.
3Manufacturing precision
If the internal space is hermetically sealed to maintain vacuum state, then thermal insulation is enhanced and sensitivity is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The integrated sealing frame combines sealing and connection functions, simplifying the structure needed to maintain the vacuum state. The sealing portion provides hermetic sealing while the connection portion provides electrical connectivity, eliminating the need for complex separate sealing mechanisms and reducing overall structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated sealing and electrical connection process lowers manufacturing costs while maintaining thermal insulation and enhancing sensitivity by suppressing temperature changes in the infrared detection element.
Implementation Method 1
A thermal infrared sensor converts infrared radiation absorbed by an infrared absorber into heat
Implementation Method 2
An insulation structure with which the infrared detector is thermally isolated from the substrate of the thermal infrared sensor increases the temperature change of the infrared detector
Implementation Method 3
The infrared detector may be held in an internal space in a vacuum in the insulation structure. This suppresses reduction in thermal resistance of the insulation structure due to heat transfer through gas and gas convection in the internal space
Data Source
AI summary
An infrared sensor includes a first semiconductor substrate, a second semiconductor substrate, a sealing frame, and a first connection. The first semiconductor substrate includes a first main surface and an infrared detection element. The second semiconductor substrate includes a second main surface and a signal processing circuit. The sealing frame surrounds an internal space with the first main surface, the infrared detection element, and the second main surface. The first connection electrically connects the infrared detection element and the signal processing circuit. The internal space is hermetically sealed by the first main surface, the infrared detection element, the second main surface, and the sealing frame. Each of the sealing frame and the first connection is sandwiched between the first main surface and the second main surface.