Infrared Sensor Package Vacuum Thermal Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing infrared sensor packages face challenges in maintaining a constant temperature without using power-consuming Pelletier elements, leading to high power consumption and increased production costs, while also struggling to efficiently suppress heat outflow to the substrate.
Innovation Solution
A power-saving infrared sensor package design that includes a plate-like heater member supported by a heat-insulating member with low thermal conductivity and a smaller cross-sectional area, which thermally separates the heater from the housing, allowing for efficient heating of the infrared detection element while reducing heat outflow and eliminating the need for additional substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a Pelletier element is used to maintain constant temperature of the infrared sensor element, then temperature stability is improved, but power consumption increases
Solution Approach 1:
The invention extracts and eliminates the Pelletier element from the temperature control system. Instead of using active cooling/heating, the patent relies on passive thermal management through vacuum insulation and strategic heat blocking structures, thereby removing the power-consuming component while maintaining temperature stability
Solution Approach 2:
The system uses self-service thermal management where the vacuum-sealed chamber and heat blocking structures automatically maintain temperature without external power input. The infrared sensor element's own heat generation combined with the insulating vacuum environment creates a self-regulating thermal system
2Device complexity
If the infrared detection element is disposed close to the substrate, then device complexity is reduced, but heat outflow to the substrate increases
Solution Approach 1:
The invention introduces a heat blocking structure as an intermediary between the infrared detection element and the substrate. This mediator blocks thermal conduction paths while allowing the detection element to remain in close proximity to the substrate for structural simplicity, thus preventing heat outflow without increasing device complexity
Solution Approach 2:
The heat blocking structure is strategically positioned only where needed - between the infrared detection element and the substrate - to block heat flow in specific critical areas while maintaining overall structural simplicity. This localized approach prevents unnecessary complexity throughout the entire device
3Loss of energy
If the cross-sectional area of the heat-insulating member is increased, then heat insulation performance is improved, but the hollow space volume decreases
Solution Approach 1:
The heat-insulating member is designed with an asymmetric cross-sectional area that is smaller than the infrared detection element's cross-section. This asymmetric configuration optimizes the balance between heat insulation performance and hollow space volume by positioning the insulating member strategically rather than uniformly surrounding the detection element
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables stable temperature maintenance of the infrared detection element with reduced power consumption and lower production costs by efficiently heating the element and minimizing heat loss, thereby enhancing sensitivity and performance.
Implementation Method 1
the inner space of the housing member is vacuum-sealed
Implementation Method 2
a heat-insulating member which has a low thermal conductivity and a smaller cross-sectional area than that of the heater member, and supports the heater member while being fixed onto the lower-surface section
Implementation Method 3
a plate-like heater member which is disposed within the inner space of the housing member and generates heat
Implementation Method 4
an upper-surface section provided with a transmission member which transmits infrared radiation
Data Source
AI summary
An infrared sensor package includes a housing member, which includes an upper-surface section provided with a transmission member which transmits infrared radiation and a lower-surface section and whose inner space is vacuum-sealed, a plate-like heater member which is disposed within the inner space of the housing member and generates heat, an infrared detection element which is fixed onto the heater member and detects the infrared radiation which is transmitted by the transmission member, and a heat-insulating member which has a low thermal conductivity and a smaller cross-sectional area than that of the heater member, and supports the heater member while being fixed onto the lower-surface section.