Infrared Sensor Variable Resistance Film LSPR
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Solution Overview
Problem
Existing infrared sensing devices, such as bolometers, have complex structures due to the need to cancel the effect of heat from the surrounding environment, making them less efficient for infrared detection.
Innovation Solution
The development of an infrared sensing device with a simple structure that utilizes a variable resistance portion made of a material potentially absorbing infrared rays through localized surface plasmon resonance (LSPR), which allows for quick variations in electrical resistance upon infrared irradiation, even at constant temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a standard resistor is provided in addition to a thermal resistor to cancel the effect of heat from the surrounding environment, then the detection accuracy is improved, but the device complexity increases
Solution Approach 1:
The invention extracts and eliminates the standard resistor component from the bolometer structure. By using a single thermal resistor that directly detects infrared rays without requiring a separate standard resistor for heat effect cancellation, the device achieves simpler structure while maintaining detection capability through the unique property that the thermal resistor's resistance changes with both temperature and infrared absorption
Solution Approach 2:
The thermal resistor is designed to perform multiple functions simultaneously: it serves as both the temperature compensation element and the infrared detection element. This multi-functionality eliminates the need for separate standard and thermal resistors, reducing device complexity while maintaining detection accuracy through the resistor's inherent properties
2Reliability
If a bolometer structure with standard resistor and thermal resistor is used, then the infrared detection capability is achieved, but the response speed is reduced
Solution Approach 1:
By removing the standard resistor and associated circuitry from the bolometer structure, the invention reduces the thermal mass and electrical complexity of the system. This extraction allows the remaining thermal resistor to respond more quickly to infrared radiation changes, improving response speed while preserving infrared detection capability
Solution Approach 2:
The invention simplifies the bolometer by segmenting out the unnecessary standard resistor component, leaving only the essential thermal resistor that directly interacts with infrared radiation. This segmentation reduces the system's overall thermal capacity and electrical complexity, enabling faster response times
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a fast and efficient detection of infrared rays with a simple device structure, improving response speed and usability in various environments, including those at ordinary temperatures.
Implementation Method 1
a material potentially absorbing an infrared ray by localized surface plasmon resonance
Implementation Method 2
reception of a carrier from a carrier supply portion including the material and being in contact with the variable resistance portion, the carrier being an electron and/or a hole, the carrier being generated by irradiation of the carrier supply portion with an infrared ray
Data Source
AI summary
The present disclosure provides an infrared sensing device having a simple structure and being capable of detecting an infrared ray. A device 300 includes a variable resistance portion 13 whose electrical resistance varies in response to an infrared ray and a detection portion that detects the variation of the electrical resistance of the variable resistance portion. The variable resistance portion satisfies at least one of i) inclusion of a material potentially absorbing an infrared ray by localized surface plasmon resonance, and ii) reception of a carrier from a carrier supply portion 23 including the above material and being in contact with the variable resistance portion, the carrier being an electron and/or a hole, the carrier being generated by irradiation of the carrier supply portion with an infrared ray.