Non-Contact Infrared Temperature Measurement for Substrate Wet Processing
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Solution Overview
Problem
Conventional wet processes for substrate processing, such as single wafer type wet etching or cleaning, face challenges in accurately measuring and maintaining the temperature of liquid chemicals and substrates, leading to processing imbalances and reduced reproducibility due to overheating.
Innovation Solution
A substrate processing apparatus and method that includes an emissivity setting unit, a radiant energy input unit, and a calculation unit to directly measure the calculation temperature of the liquid chemical or the interface between the substrate and the liquid chemical, using Equation E(λ,T)=ɛC1λ5(eC2λT-1) to calculate absolute temperature, and a control unit to adjust the processing temperature accordingly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional temperature measurement methods are used in wet processes, then the measurement system is simple, but the temperature measurement accuracy is insufficient leading to processing imbalances
Solution Approach 1:
The patent replaces conventional contact-based temperature measurement methods with non-contact infrared temperature measurement. The infrared temperature measurement unit directly measures the temperature of the liquid chemical or substrate surface without physical contact, eliminating the complexity of immersion probes and thermal coupling mechanisms while achieving accurate temperature monitoring through radiative heat transfer detection.
Solution Approach 2:
The patent introduces an infrared transmission window as an intermediary component that allows infrared radiation to pass through while protecting the measurement system. This window enables the infrared temperature measurement unit to measure temperatures through the chamber wall or protective barriers without direct exposure to the liquid chemical environment, simplifying the measurement system while maintaining accuracy.
2Manufacturing precision
If temperature is not accurately controlled, then the processing speed is fast, but the manufacturing precision deteriorates due to overheating
Solution Approach 1:
The patent implements a closed-loop temperature control system where the infrared temperature measurement unit continuously monitors the temperature of the liquid chemical or substrate, and the control unit adjusts heating or cooling based on the measured values. This feedback mechanism ensures temperature remains within the optimal range, preventing overheating and ensuring uniform processing across the substrate surface.
Solution Approach 2:
The patent performs preliminary temperature measurement and adjustment before the actual processing begins. The system pre-heats or pre-cools the liquid chemical to the target temperature, and measures the substrate temperature before processing to ensure it is within the required range, thereby preventing temperature-related processing defects from the outset.
3Reliability
If conventional wet process methods are used, then the productivity is high, but the reliability deteriorates due to temperature measurement difficulties
Solution Approach 1:
The patent replaces complex contact-based temperature measurement systems with non-contact infrared measurement, eliminating the need for probe insertion, thermal coupling, and frequent calibration. This simplification maintains high processing throughput while ensuring reliable and reproducible temperature measurements across multiple substrates and processing cycles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for accurate and efficient management of processing temperatures, enhancing reproducibility and precision in wet processes, preventing overheating, and maintaining uniform temperature distribution across the substrate, thereby reducing defects and improving yield.
Implementation Method 1
a radiant energy input unit to which radiant energy radiating from the liquid chemical or the interface is input
Implementation Method 2
a calculation unit that calculates a calculation temperature of the liquid chemical or the interface based on the emissivity and the radiant energy
Data Source
AI summary
Disclosed are a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes an emissivity setting unit to which emissivity at a liquid chemical which is brought into contact with a substrate or emissivity at an interface at which the substrate and the liquid chemical are in contact with each other is input, a radiant energy input unit to which radiant energy radiating from the liquid chemical or the interface is input, and a calculation unit that calculates a calculation temperature of the liquid chemical or the interface based on the emissivity and the radiant energy.