Infrared Temperature Measurement Using Board Temperature Compensation
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Solution Overview
Problem
Existing thermal imaging systems face precision issues in measuring object temperatures with high accuracy due to the inability to mount a temperature sensor on the shutter, leading to inaccuracies, particularly when measuring body temperatures with an error of 0.5 degrees or less.
Innovation Solution
A temperature measurement apparatus and method that compensates for board temperature using an infrared sensor module, a board temperature compensation module, and a calculation module to obtain accurate object temperatures without a shutter, by employing functions derived from reference temperatures of the board and a black body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a temperature sensor is mounted on the board to measure shutter temperature, then the device complexity is reduced, but the measurement precision deteriorates due to the temperature difference between the board and the shutter
Solution Approach 1:
The patent introduces a mathematical model as an intermediary between the board temperature measurement and the shutter temperature estimation. The model establishes a functional relationship (first function) between board temperature and shutter temperature, allowing accurate shutter temperature derivation without direct sensor contact. This mediator resolves the contradiction by enabling precise measurement through computational transformation rather than direct physical sensing.
Solution Approach 2:
The patent transforms the measurement parameter from direct shutter temperature to board temperature, which is easier to measure. By establishing a mathematical relationship between these parameters, the system changes the measurement approach from difficult (shutter temperature) to easy (board temperature) while maintaining accuracy through the derived functional relationship.
2Reliability
If a shutter is used in the thermal imaging system, then the measurement reliability improves, but the device complexity increases due to the need for shutter temperature measurement
Solution Approach 1:
The patent extracts the temperature measurement function from the shutter assembly and relocates it to the board level. By removing the requirement for shutter-mounted sensors and implementing temperature compensation through board measurements and mathematical modeling, the system maintains measurement reliability while eliminating the complexity of direct shutter temperature sensing.
3Ease of operation
If the board temperature is used as shutter temperature without compensation, then the ease of operation improves, but the measurement precision deteriorates for high accuracy requirements
Solution Approach 1:
The patent replaces the mechanical approach of direct shutter temperature sensing with a computational system. Instead of physically mounting sensors on the shutter, the system uses mathematical models and algorithms to calculate shutter temperature from board temperature measurements, substituting mechanical complexity with computational processing to maintain both ease of operation and measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise temperature measurement of objects with high accuracy by compensating output voltages using board and black body reference functions, eliminating the need for a shutter.
Implementation Method 1
an infrared sensor module for providing an output voltage due to infrared radiated by the object
Data Source
AI summary
An apparatus for measuring temperature of an object using compensation of board temperature may include an infrared light sensor module for providing output voltage due to the infrared light emitted by an object; a board temperature compensation module for compensating the provided output voltage to the output voltage at the reference configuration temperature of the board using a first function of output voltage to board temperature obtained at a reference configuration temperature of a blackbody; and a calculation module for obtaining the temperature of the object from the compensated output voltage using a second function of temperature of the blackbody to the output voltage obtained at a reference configuration temperature of the board.