Infrared Wafer Temperature Sensor with Diamond-Like Carbon Window
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Solution Overview
Problem
Conventional semiconductor wafer cleaning apparatus temperature sensors lack chemical resistance and waterproofing, leading to temperature reproducibility issues and reduced effectiveness in environments with cleaning solution fumes.
Innovation Solution
Infrared temperature sensors with chemical resistance and waterproofing properties are installed inside the semiconductor wafer cleaning apparatus, capable of real-time surface temperature monitoring, using a configuration with a back-end cover member, intermediate cover member, and window member coated with diamond-like carbon for chemical resistance, and a front-end cover member for water prevention, allowing accurate temperature measurement even in fume-generating environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional temperature sensors are installed inside the cleaning chamber to measure wafer surface temperature, then temperature measurement capability is provided, but the sensors lack chemical resistance and waterproofing causing temperature reproducibility issues and reduced effectiveness in fume-generating environments
Solution Approach 1:
An infrared-transparent window member is introduced as an intermediary between the infrared temperature sensor and the wafer surface. This window member allows infrared radiation to pass through while protecting the sensor from direct exposure to cleaning solution fumes, chemicals, and moisture in the cleaning chamber, thereby maintaining both measurement accuracy and sensor reliability
Solution Approach 2:
The patent replaces conventional contact-based temperature sensors with infrared temperature sensing technology. This non-contact measurement method eliminates the need for the sensor to physically contact the wafer or be exposed to the harsh chemical environment, while still providing accurate temperature measurements through detection of infrared radiation emitted by the wafer surface
2Measurement precision
If the incident angle of infrared rays is not maintained at 90 degrees, then the structure is simpler, but temperature correction in respective sections cannot be performed
Solution Approach 1:
The sensor structure is pre-configured with the infrared camera positioned at a 90-degree incident angle to the window member surface. This preliminary arrangement ensures optimal infrared ray transmission and eliminates the need for complex real-time angle adjustment mechanisms, maintaining measurement accuracy while keeping the structure relatively simple
Solution Approach 2:
The patent maintains the incident angle parameter at a fixed 90 degrees, which is the optimal angle for infrared transmission through the window member. By controlling this geometric parameter, the system achieves accurate temperature measurements without requiring complex adaptive mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables real-time monitoring and correction of surface temperatures, reducing defects and improving yield by maintaining accurate temperature readings and preventing damage from fumes, while allowing for the detection of excessive heating due to chemical reactions and friction during the cleaning process.
Implementation Method 1
an infrared temperature sensor for measuring the surface temperatures of a wafer
Implementation Method 2
window member which is located in front of the infrared camera of the temperature sensor part and has chemical resistance and abrasion resistance
Implementation Method 3
an environment in which there is fume generated from a cleaning solution
Data Source
AI summary
A method of monitoring the surface temperatures of wafers in real time by measuring them according to the present invention monitors the surface temperatures of a polishing pad in real time by measuring them, and can thus actively deal with irregular variations in temperature on the surface of the wafer attributable to chemical reaction and friction in the process of cleaning the wafer. A sensor for measuring the surface temperatures of a wafer according to the present invention can be used in an environment in which there is fume generated from a cleaning solution, and is responsible for temperatures at respective points of an infrared camera and allows the correction of temperatures in respective sections.