Infrared Transmission Window for Non-Contact Wafer Temperature Measurement

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing substrate processing technologies face challenges in accurately measuring the temperature of wafers within a chamber from outside, especially when using an LED light source as a heat source, due to the pressure-reduced atmosphere and the need for non-contact measurement.

Innovation Solution

A substrate processing apparatus is designed with a heat ray sensor and an infrared ray transmission window that allows for non-contact temperature measurement by receiving infrared rays with wavelengths greater than or equal to 8 μm, using a thermopile and diamond window to accurately calculate the wafer temperature despite noise from the heat source and chamber components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If non-contact temperature measurement is performed from outside the chamber, then measurement accessibility is improved, but measurement precision deteriorates due to interference from chamber components and pressure-reduced atmosphere

Engineering Contradiction:
Improvemeasurement accessibilityVSAvoidtemperature measurement accuracy
Core Design Contradiction:
Ease of operationVSMeasurement precision

Solution Approach 1:

An infrared transmission window is introduced as an intermediary component between the substrate inside the chamber and the heat ray sensor outside. This window selectively transmits infrared rays with wavelengths of 8 μm or more while blocking other wavelengths, enabling accurate non-contact temperature measurement by allowing the desired thermal radiation to pass through while filtering out interfering radiation from chamber components.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the wavelength parameter of infrared radiation being measured by selecting and transmitting only wavelengths of 8 μm or more. This parameter selection allows the system to measure substrate temperature accurately by focusing on the thermal radiation band that is least affected by interference from the LED light source and chamber components, while still being emitted by the heated substrate.

Inventive Principle:
Principle #35Parameter changes

2Use of energy by moving object

If LED light source is used for heating, then energy efficiency is improved, but temperature measurement accuracy deteriorates due to noise from the light source and chamber components

Engineering Contradiction:
Improveenergy efficiencyVSAvoidtemperature measurement accuracy
Core Design Contradiction:
Use of energy by moving objectVSMeasurement precision

Solution Approach 1:

The infrared transmission window acts as a spectral filter that distinguishes between the heating radiation from the LED light source and the thermal radiation from the heated substrate. By transmitting only infrared rays with wavelengths of 8 μm or more, it blocks the shorter wavelength radiation from the LED while allowing the longer wavelength thermal radiation from the substrate to reach the sensor, thereby eliminating measurement noise.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the wavelength parameter of the detected radiation to 8 μm or more, which corresponds to the thermal radiation emitted by the substrate at heating temperatures. This parameter change effectively filters out the LED light source noise while capturing the substrate temperature signal, enabling accurate measurement despite the presence of the LED heating source.

Inventive Principle:
Principle #35Parameter changes

3Productivity

If heating time is reduced for improved productivity, then processing speed is improved, but temperature control accuracy deteriorates

Engineering Contradiction:
Improveprocessing throughputVSAvoidtemperature control accuracy
Core Design Contradiction:
ProductivityVSMeasurement precision

Solution Approach 1:

The invention implements a feedback control system where the heat ray sensor continuously measures the substrate temperature through the infrared transmission window, and the LED light source controller adjusts the heating power based on this real-time temperature information. This feedback mechanism enables accurate temperature control even during rapid heating processes, maintaining processing quality while improving throughput by reducing heating time.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The invention replaces contact-based temperature measurement methods with non-contact infrared measurement. This substitution allows for rapid, real-time temperature monitoring without physical contact, enabling faster heating cycles while maintaining precise temperature control through continuous feedback from the heat ray sensor.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables precise temperature measurement and feedback control of the LED light source, significantly reducing heating time and improving processing throughput by accurately measuring temperatures within the desired range of room temperature to 300 degrees C.

Implementation Method 1

a heat ray sensor provided outside the chamber and configured to receive infrared rays radiated from the substrate

Methodology Applied
Scientific EffectInfrared radiation: Infrared Radiation

Implementation Method 2

an infrared ray transmission window provided in the chamber and configured to transmit an infrared ray having a wavelength greater than or equal to 8 μm to the heat ray sensor

Methodology Applied
Scientific EffectInfrared transmission: Infrared Radiation

Implementation Method 3

a heat source configured to heat-treat the substrate

Methodology Applied
Scientific EffectHeating: Heating

Data Source

PatentUS20230005798A1Substrate processing apparatus and substrate processing method
Publication Date: 2023.01.05 TOKYO ELECTRON LTD
  • US20230005798A1 patent drawing
  • US20230005798A1 patent drawing
  • US20230005798A1 patent drawing

AI summary

The present disclosure is a substrate processing apparatus including: a chamber configured to accommodate a substrate; a heat source configured to heat-treat the substrate; a heat ray sensor provided outside the chamber and configured to receive infrared rays radiated from the substrate; and an infrared ray transmission window provided in the chamber and configured to transmit an infrared ray having a wavelength greater than or equal to 8 μm to the heat ray sensor.