Inhibitor Compounds for Selective Surface Passivation

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Solution Overview

Problem

Existing technologies face challenges in selectively depositing precursor materials on non-metal surfaces while preventing deposition on metal surfaces, leading to unwanted contamination and inefficiencies in surface passivation.

Innovation Solution

The use of an inhibitor compound, specifically an alkyne compound functionalized with at least one alkoxy group, which is exposed to a substrate to form a first layer on the metal surface, thereby preventing precursor deposition on the metal surface while allowing deposition on the non-metal surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If precursor vapor is deposited on a substrate with both metal and non-metal surfaces, then deposition occurs on both surfaces, but unwanted deposition on metal surfaces causes contamination and inefficiency

Engineering Contradiction:

Improveselectivity of depositionVSAvoidprecursor contamination on metal surfaces

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The inhibitor compound is applied to the metal surface before precursor deposition to prevent unwanted precursor deposition. This preliminary action of forming an inhibitor layer eliminates the need for subsequent removal steps and ensures selective deposition only on non-metal surfaces.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The inhibitor compound acts as an intermediary substance between the precursor vapor and the metal surface. It mediates the interaction by providing a protective layer that prevents direct contact between the precursor and metal surface, thereby enabling selective deposition on non-metal surfaces only.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If inhibitor compound is used to passivate metal surfaces, then selective deposition on non-metal surfaces is achieved, but additional process steps are required

Engineering Contradiction:

Improveselective surface passivationVSAvoidnumber of process steps

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The inhibitor compound serves multiple functions: it passivates metal surfaces, enables selective deposition on non-metal surfaces, and acts as a sacrificial layer that can be removed along with unwanted precursor deposits. This multi-functionality reduces the need for separate process steps.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The process combines the passivation step and the deposition step into a single integrated sequence where the inhibitor layer is formed and then the precursor is deposited in one continuous process flow, reducing overall process complexity.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively prevents precursor deposition on metal surfaces, maintaining their passivation, while allowing selective deposition on non-metal surfaces, enhancing the precision and efficiency of surface treatment processes.

Implementation Method 1

exposing a substrate to an inhibitor compound to form a first layer on a metal surface of the substrate

Methodology Applied

Scientific EffectAdsorption: Adsorption

Implementation Method 2

exposing the substrate to a precursor vapor to form a second layer on a non-metal surface of the substrate

Methodology Applied

Scientific EffectVapour deposition: Physical Vapour Deposition

Data Source

PatentUS20250109502A1Inhibitor compounds for selective passivation of surfaces

Publication Date: 2025.04.03 ENTEGRIS INC

AI summary

Methods for selective passivation for metals and related systems and related methods are provided. A method comprises one or more of the following steps: exposing a substrate to an inhibitor compound to form a first layer on a metal surface of the substrate, wherein the inhibitor compound comprises an alkyne compound functionalized with at least one alkoxy group; and exposing the substrate to a precursor vapor to form a second layer on a non-metal surface of the substrate. Other methods and systems are provided herein.