Injection Assembly for Thermal Interface Material Coating

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional methods for applying thermal interface materials (TIMs) to heating modules in controllers are time-consuming and risk damaging the chips or circuit boards due to pressure application.

Innovation Solution

An injection assembly that simultaneously injects and applies an injection material with low viscosity into multiple coating portions, using a cover part with injection holes and a nozzle unit with pressure sensors to control injection speed and prevent damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the sandwich method is used to coat TIM on heating elements before assembly, then the TIM can be applied to multiple chips, but the processing time increases and the chips may be damaged due to pressure

Engineering Contradiction:
Improvenumber of chips coatedVSAvoidcoating process cycle
Core Design Contradiction:
Quantity of substanceVSLoss of time

Solution Approach 1:

The injection holes are pre-formed in the cover part at positions corresponding to the heating elements before assembly. This preliminary preparation allows the TIM to be injected directly into the assembled structure, eliminating the need for separate pre-coating steps and reducing the overall process cycle time.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent uses an injection system that utilizes pressure differential (pneumatic/hydraulic principle) to push the TIM through the injection holes from the cover part into the heating element gaps. This automated injection method replaces manual coating processes, significantly reducing processing time while applying controlled pressure that prevents chip damage.

Inventive Principle:
Principle #29Pneumatics and hydraulics

2Quantity of substance

If the sandwich method is used to coat TIM on heating elements, then multiple chips can be coated, but the chips and circuit boards may be damaged due to pressure application

Engineering Contradiction:
Improvenumber of chips coatedVSAvoidpressure damage to chip and circuit board
Core Design Contradiction:
Quantity of substanceVSObject-affected harmful factors

Solution Approach 1:

The injection system uses controlled pressure differential to push TIM through injection holes. The pressure is applied gradually and controlled by the injection mechanism, preventing sudden or excessive pressure spikes that could damage the chips or circuit boards, while still achieving complete TIM filling of the heating element gaps.

Inventive Principle:
Principle #29Pneumatics and hydraulics

Solution Approach 2:

The injection holes act as intermediaries that guide the TIM flow directly to the heating element gaps. This intermediary structure allows the TIM to be delivered precisely where needed without requiring direct pressure application to the chip surfaces, thereby preventing damage while ensuring complete coating.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If conventional coating methods are used for multiple chips, then the TIM can be applied to each chip, but the number of coating operations increases the process cycle

Engineering Contradiction:
ImproveTIM coating completenessVSAvoidcoating process cycle
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent merges the TIM injection function with the existing assembly structure by integrating injection holes into the cover part. This allows multiple heating elements to be coated simultaneously through a single injection operation, combining what would otherwise be multiple separate coating operations into one unified process, thereby reducing the overall process cycle while maintaining coating completeness.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The injection system is designed to serve multiple heating elements simultaneously through a single operational cycle. The injection holes are positioned to correspond with multiple heating element locations, allowing the same injection mechanism to coat multiple chips in sequence or parallel, thereby improving productivity without compromising coating reliability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly reduces processing time, prevents damage to heating elements and circuit boards, and ensures complete coating of the surface with the injection material, enhancing heat transfer efficiency.

Implementation Method 1

a nozzle unit (200) including a plurality of nozzles (210) to simultaneously inject an injection material into the plurality of injection holes (120)

Methodology Applied
Scientific EffectPressure-driven flow: Pressure Gradient

Implementation Method 2

using the injection material with a relatively low viscosity to prevent generation of an air layer so as to completely coat a coating surface with the injection material

Methodology Applied
Scientific EffectViscosity: Viscometer

Implementation Method 3

The TIM decreases thermal resistance between a heating element and a heat sink so that heat is smoothly transferred from the heating element to the heat sink

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250073972A1Injection assembly
Publication Date: 2025.03.06 HYUNDAI MOBIS CO LTD
  • US20250073972A1 patent drawing
  • US20250073972A1 patent drawing
  • US20250073972A1 patent drawing

AI summary

An injection assembly including a cover part which covers an upper surface of a controller and in which a plurality of injection holes are formed to correspond to positions of a plurality of heating elements and a nozzle unit including a plurality of nozzles to simultaneously inject an injection material into the plurality of injection holes, wherein a pressure sensor is disposed in each of the plurality of nozzles to measure an internal pressure of the nozzle and to control an injection speed based on the measured internal pressure.