Injection Molding Discharge Bypass for Heat Medium Pressure

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Solution Overview

Problem

Conventional injection molding devices experience a decrease in heating rate during the second half of the heating process due to increased pipe length of the discharge line, leading to fluid pressure loss and heat release, which reduces the effectiveness of the heat medium in heating the mold.

Innovation Solution

The discharge rate adjusting unit is positioned upstream from the mold temperature adjustor, reducing the pipe length of the discharge line, and includes a variable flow control valve and bypass pipe to maintain high pressure and flow rate of the heat medium, preventing heat loss and ensuring efficient heating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the discharge line pipe length is increased to accommodate a mold temperature adjustor positioned away from the mold, then the device complexity and ease of operation are improved, but the fluid pressure loss increases and the heat medium pressure decreases

Engineering Contradiction:
Improveease of operationVSAvoidheat medium pressure
Core Design Contradiction:
Ease of operationVSStress or pressure

Solution Approach 1:

The patent introduces a bypass line as an intermediary pathway that allows the heat medium to bypass the long discharge line when high pressure is required. This mediator (bypass line) enables the system to achieve both long pipe length for ease of operation and high pressure for effective heating by providing an alternative route.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The discharge path is segmented into two routes: the main discharge line (long path) and the bypass line (short path). This segmentation allows the system to select the appropriate path based on operational requirements, maintaining high pressure when needed while accommodating the mold temperature adjustor position.

Inventive Principle:
Principle #1Segmentation

2Device complexity

If the discharge line pipe length is increased, then the device complexity is reduced by positioning the mold temperature adjustor away from the mold, but the heat release to surrounding areas increases

Engineering Contradiction:
Improvedevice complexityVSAvoidheat release
Core Design Contradiction:
Device complexityVSLoss of energy

Solution Approach 1:

The bypass line acts as an intermediary that provides a short, insulated pathway for the heat medium to travel when minimal heat release is required. This allows the system to maintain energy efficiency while still positioning the mold temperature adjustor away from the mold for operational convenience.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The system segments the heat medium flow into two paths: the long discharge line that is acceptable for normal operation and the short bypass line that minimizes heat release when energy efficiency is prioritized.

Inventive Principle:
Principle #1Segmentation

3Stress or pressure

If the heat medium pressure is reduced due to increased pipe length, then the fluid pressure loss decreases, but the heating rate of the mold decreases

Engineering Contradiction:
Improvefluid pressure lossVSAvoidheating rate
Core Design Contradiction:
Stress or pressureVSProductivity

Solution Approach 1:

The system dynamically switches between the main discharge line and the bypass line based on the heating requirements. During high-speed heating phases, the bypass line is activated to maintain high pressure and heating rate, while the main line handles normal operation where pressure loss is less critical.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The bypass line serves as an intermediary high-pressure pathway that enables rapid heating by providing a short route for the heat medium, compensating for the pressure loss that would otherwise occur in the long discharge line.

Inventive Principle:
Principle #24Intermediary (Mediator)

4Stress or pressure

If the heat medium temperature is lowered due to heat release in the discharge line, then the fluid pressure loss decreases, but the heating effectiveness of the heat medium decreases

Engineering Contradiction:
Improvefluid pressure lossVSAvoidheat medium temperature
Core Design Contradiction:
Stress or pressureVSTemperature

Solution Approach 1:

The bypass line functions as a thermal intermediary that preserves the high temperature of the heat medium by providing a short, minimized heat loss pathway. This allows the heat medium to maintain its heating effectiveness while still managing pressure through the bypass route.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The thermal path is segmented into the long heat-loss-prone discharge line and the short temperature-preserving bypass line, allowing the system to select the path that maintains heat medium temperature for effective heating.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration maintains a high heating rate for the mold by minimizing fluid pressure loss and heat release, allowing the mold to reach the target temperature quickly and efficiently, even with a large-size injection molding machine.

Implementation Method 1

a heat medium is supplied to heat the mold

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

steam is supplied to heat the mold

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

a steam trap 12 is installed on the ordinary discharge line 13

Methodology Applied
Scientific EffectCondensation: Condensation

Data Source

PatentUS9011750B2Injection molding device and method for discharging heat medium for injection molding device
Publication Date: 2015.04.21 MITSUBISHI HEAVY INDS PLASTIC TECH
  • US9011750B2 patent drawing
  • US9011750B2 patent drawing
  • US9011750B2 patent drawing

AI summary

The injection molding device of the present invention is provided with a supply pipe which supplies a heat medium to a mold, a discharge pipe which discharges the heat medium from the mold, a mold temperature adjustor to which the supply pipe and the discharge pipe are connected to adjust the temperature of the mold, and a discharge rate adjusting unit which is provided with a variable flow control valve installed on the discharge pipe to adjust a flow rate of the heat medium, a discharge pipe variable flow control valve bypass pipe for bypassing the variable flow control valve and a discharge pipe bypass on-off valve installed on the bypass pipe to change a flow rate of the heat medium and which is installed at a position upstream from the mold temperature adjustor on the discharge pipe.