Injection-Moulded Casing Seam for Hermetic Electronics Encapsulation
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Solution Overview
Problem
Existing casing manufacturing methods for electronics are limited by cost, material constraints, and reliability, particularly in providing a hermetically sealed and durable enclosure that can withstand impacts, temperature variations, and chemical exposure.
Innovation Solution
The method involves forming a casing by connecting two casing components with a sealing groove along the seam, which is then hermetically sealed using injection moulding. This process allows for the use of elastomers as the material for both the casing components and the injection moulding, enhancing the casing's protective properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional casing manufacturing methods are used, then cost and material constraints are easier to manage, but the casing cannot provide hermetic sealing and sufficient protection against impacts, temperature variations, and chemicals
Solution Approach 1:
The invention combines the casing components and sealing function into a single integrated structure. The first and second casing components are connected to form a seam that is hermetically sealed through injection moulding, eliminating the need for separate sealing elements or adhesives. This merging of structural and sealing functions achieves both high reliability and manufacturing efficiency.
Solution Approach 2:
The invention uses composite material construction where the casing is made from at least two different materials with good adhesion between them. The injection moulding process fills a sealing groove with a material that bonds well to the casing components, creating a hermetically sealed joint that provides superior protection against environmental factors while maintaining manufacturing feasibility.
2Ease of manufacture
If adhesives are used for sealing the seam, then the manufacturing process is simple, but toxic materials are used which decrease safety and increase environmental impact
Solution Approach 1:
The invention replaces the chemical bonding mechanism of adhesives with a mechanical injection moulding process. Molten material is injected under pressure to fill the sealing groove and bond the casing components together. This mechanical/thermal process eliminates the need for toxic adhesives while maintaining manufacturing simplicity and producing a hermetically sealed joint.
3Reliability
If the sealing groove is not properly designed, then the manufacturing process is simpler, but the injection molded material cools down too quickly and cannot melt the casing components together
Solution Approach 1:
The invention optimizes the geometric parameters of the sealing groove to control the cooling rate of the injection molded material. The groove's cross-sectional area, depth, and shape are specifically designed to maintain heat longer during the injection process, allowing the molten material to sufficiently melt and bond the casing components together before cooling, thereby achieving reliable hermetic sealing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a durable, impermeable, and cost-effective casing with improved resistance to impacts, temperature extremes, and chemicals, providing enhanced protection for electronics without the use of toxic adhesives.
Implementation Method 1
the sealing groove is filled with a sufficient amount of material to melt the first and the second casing component together by the injection moulding
Data Source
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AI summary
Various example embodiments relate to seaming a casing using injection moulding. The casing may be used for encapsulation of electronics. The injection moulded seam enables hermetically sealed encapsulation and use of elastomers for the casing. A casing for encapsulation and a manufacturing method for a casing is provided.