Injector Scavenging System for Substrate Processing
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Solution Overview
Problem
Conventional substrate processing apparatuses face issues with sudden gas introduction leading to particle contamination in the reaction vessel due to unstable gas flow rates, causing quartz nozzle damage and film delamination, which results in particles being brought into the reaction vessel and adhering to substrates, requiring cumbersome maintenance and potential blockage of gas supply lines.
Innovation Solution
A substrate processing apparatus with a scavenging system that connects the gas supply part to a scavenging part, allowing for negative pressure control within the injector to scavenge particles before gas supply, thereby preventing their introduction into the process vessel, even during sudden gas introduction events.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If gas is supplied into the reaction vessel by an injector while adjusting flow rate with an MFC, then the film forming process can be performed, but the flow rate takes time to stabilize and sudden gas introduction occurs, causing particles to be brought into the reaction vessel
Solution Approach 1:
The scavenging part is activated before gas supply begins to pre-scan the interior of the gas supply part and remove particles. This preliminary scavenging action ensures that when gas is introduced, particles are already removed from the gas supply path, preventing particle contamination during the film forming process.
Solution Approach 2:
The scavenging part acts as an intermediary component between the gas supply part and the reaction vessel. It serves as a particle removal zone that intercepts particles before they can enter the reaction vessel, mediating between the gas supply system and the processing environment.
2Reliability
If the gas supply line is disassembled and cleaned to prevent particles, then particle contamination can be reduced, but maintenance work becomes troublesome and time-consuming
Solution Approach 1:
The scavenging part enables the gas supply system to clean itself automatically during operation. By continuously scavenging particles from the interior of the gas supply part, the system performs self-maintenance without requiring manual disassembly and cleaning, thereby maintaining reliability while simplifying operation.
3Reliability
If reaction gas is introduced into the gas nozzle to solidify particle source and prevent particle generation, then particle contamination is reduced, but the gas holes of the gas nozzle become blocked, making it impossible to perform the original gas supply
Solution Approach 1:
The scavenging part extracts and removes particles from the gas supply path before they can accumulate in the gas nozzle. By continuously removing particles through the scavenging mechanism, the gas holes remain clear and functional, allowing normal gas supply to continue without blockage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively suppresses particle contamination in the reaction vessel, reducing substrate particle adhesion and maintaining productivity by ensuring stable gas flow and preventing nozzle blockages, thus enhancing the overall efficiency and reliability of the substrate processing process.
Implementation Method 1
in the scavenging an interior of the injector, an internal pressure of the injector is controlled to have a negative pressure
Data Source
AI summary
There is provided a substrate processing apparatus, including: a process vessel configured to accommodate a plurality of substrates; a gas supply part configured to supply a gas into the process vessel; an exhaust part configured to exhaust the gas in the process vessel; and a scavenging part configured to scavenge an interior of the gas supply part, wherein the gas supply part is connected to the scavenging part.