Ink Cartridge IC Substrate Positioning via Protrusions
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Solution Overview
Problem
Existing inkjet recording apparatuses face challenges in accurately positioning and securely fixing IC chips within ink cartridges to prevent detachment or misalignment during shipment or impact, which complicates assembly and increases manufacturing costs.
Innovation Solution
The method involves affixing an IC substrate to the ink cartridge using protrusions and notches on a substrate support, with a fixing portion that softens and solidifies upon heating to securely position and fix the IC chip, ensuring accurate electrical connections and reducing operational complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If image processing is used to position the IC chip, then positioning accuracy is improved, but assembly complexity increases
Solution Approach 1:
The cartridge mount is designed with pre-formed protrusions and the substrate support is designed with pre-formed notches before assembly. These mechanical features are created in advance during manufacturing, eliminating the need for complex image processing and real-time positioning adjustments during assembly. The IC chip substrate is positioned simply by aligning these pre-designed mechanical features.
2Reliability
If the IC chip is securely fixed to prevent detachment during shipment, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The protrusions on the cartridge mount and notches on the substrate support are integrated into the existing structural components. The fixing portion is formed as part of the substrate support structure itself, combining the support function and the fixing function into a single integrated component. This eliminates the need for separate fixing mechanisms and reduces manufacturing complexity.
Solution Approach 2:
The fixing portion acts as an intermediary element between the substrate support and the IC chip substrate. When heated, it softens to allow positioning, then solidifies to create a secure mechanical bond. This intermediary material provides reliable fixation while maintaining a simple manufacturing process through thermal cycling.
3Ease of operation
If a fixing portion that softens and solidifies upon heating is used, then ease of assembly is improved, but manufacturing process complexity increases
Solution Approach 1:
The fixing portion's physical properties are changed through temperature control. During assembly, heat is applied to soften the fixing portion, allowing the IC chip substrate to be easily positioned and aligned. After positioning, the component cools and the fixing portion solidifies, creating a secure bond. This parameter change enables simple assembly operations.
Solution Approach 2:
The fixing portion utilizes phase transition between solid and soft states through heating and cooling. In the softened state, it allows easy positioning and alignment of the IC chip substrate. Upon cooling, it transitions back to a solid state, providing strong mechanical fixation. This phase transition simplifies the assembly operation while the process can be integrated into existing manufacturing equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures the IC chip is securely fixed with high positional accuracy and reliability, reducing the risk of detachment and simplifying the assembly process while maintaining cost-effectiveness.
Implementation Method 1
a fixing portion that softens and solidifies upon heating to securely position and fix the IC chip
Data Source
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AI summary
A cartridge (30) includes a main body (31) having a chamber (36) formed therein for receiving an imaging material, a circuit board (81) having a first opening (85) and a second opening (86) formed through the circuit board (81), and an electrode (82, 83, 84) disposed on the circuit board (81). The main body (31) includes a support surface (39) that supports the circuit board (81); a first protrusion (61) and a second protrusion (62) protruding from the support surface (39), such that a portion of the first protrusion (61) is disposed in the first opening (85) of the circuit board (81) and a portion of the second protrusion (62) is disposed in the second opening (86) of the circuit board (81), and a third protrusion (63) protruding from the support surface (39). A portion of the third protrusion (63) contacts a first surface of the circuit board (81) facing away from the support surface (39). A method for manufacturing the cartridge is also disclosed.