Ink Flow Path Resin Layer for Interface Adhesion and Ink Resistance
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Solution Overview
Problem
Ink ejection devices face issues with ink penetration at the interface between base materials or on base materials due to the high permeability of aqueous inks containing solvents, leading to reduced adhesive strength and reliability.
Innovation Solution
The ink ejection device incorporates a resin layer with specific surface compositions containing carbon, oxygen, nitrogen, and silicon, ensuring that the principal surface meets certain atomic concentration ratios and includes a curing agent with a pKa of 3 or more, enhancing chemical bonding and ink resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If aqueous ink with high solvent content is used to improve printing properties, then printing quality on non-absorbent film medium is improved, but ink penetration to the interface between base material and resin layer increases, reducing adhesive strength
Solution Approach 1:
The resin layer is designed with non-uniform composition: the first region (contacting ink) contains hydrophobic components to resist ink penetration, while the second region (interface with base material) maintains adhesive properties. This local differentiation allows the resin layer to simultaneously resist ink penetration and maintain adhesion to the base material.
Solution Approach 2:
The resin layer is formed as a composite material containing both hydrophobic components (for ink resistance) and adhesive components (for bonding to base material). This composite structure enables the resin layer to perform dual functions: resisting ink penetration from the first region while maintaining strong adhesion at the interface with the base material.
2Reliability
If resin layer composition is optimized for ink resistance, then ink penetration is reduced, but adhesion to base material may be compromised
Solution Approach 1:
The resin layer is designed with non-uniform composition: the first region (contacting ink) contains hydrophobic components to resist ink penetration, while the second region (interface with base material) maintains adhesive properties. This local differentiation allows the resin layer to simultaneously resist ink penetration and maintain adhesion to the base material.
Solution Approach 2:
The resin layer is divided into two distinct regions with different functional compositions: a first region for ink resistance and a second region for adhesion. This segmentation allows each region to be optimized for its specific function without compromising the other.
3Ease of manufacture
If conventional resin layer is used, then manufacturing is simple, but long-term reliability under ink exposure is insufficient
Solution Approach 1:
The composition parameters of the resin layer are changed by introducing hydrophobic components with specific molecular structures (such as fluorinated or silane-modified compounds). These parameter changes enhance ink resistance while maintaining manufacturability through conventional coating and curing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides long-term reliability by improving adhesiveness and ink resistance at the interface, preventing ink penetration and maintaining device integrity.
Implementation Method 1
the resin layer contains carbon, oxygen, nitrogen and silicon... at least one of the principal surfaces satisfies the following requirements (1) and (2)... the ratio of the principal surface Si to the interior Si represented by the principal surface Si/the interior Si is 5 or more
Data Source
AI summary
An ink ejection device includes a base material, a resin layer having at least one principal surface laminated to the base material to be in contact with the base material, and an ink flow path disposed such that an ink contacts and circulates in a part of the resin layer, wherein the resin layer contains carbon, oxygen, nitrogen and silicon, and at least one of the principal surfaces satisfies the following requirements (1) and (2). (1) the principal surface is in contact with the base material. (2) the relation of the atomic concentration (atm %) of nitrogen, oxygen and silicon in the principal surface of the resin layer and the interior thereof measured by X-ray photoelectron spectroscopy is represented by the principal surface O>the interior O, and the principal surface N>0, and the principal surface Si/the interior Si is 5 or more.