Ink Jet Head Warpage Reducing Layer for Uniform Ejection
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Solution Overview
Problem
Ink jet heads face challenges in maintaining uniform precision in the landing position of ink ejected from nozzles across the entire length, due to variations in ejecting angles and potential warpage, which can lead to deteriorated image quality and risk of substrate damage from stress distortion.
Innovation Solution
The ink jet head incorporates a pressure chamber with a warpage reducing layer on one face and a vibrating plate with a piezoelectric driving unit, along with a protective film and ink repellent film, to control the deformation of the nozzle plate and maintain consistent ink ejecting angles, utilizing a warpage reducing film to minimize substrate warpage and stress distortion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a piezoelectric element and actuator are provided on a vibrating plate to eject ink from a nozzle, then ink ejection function is achieved, but warpage of the substrate occurs causing non-uniform ejecting angles and deteriorated image quality
Solution Approach 1:
A warpage reducing layer is provided only on the second face of the pressure chamber substrate, creating localized structural reinforcement. This layer has different material properties (higher rigidity or different thermal expansion characteristics) compared to the substrate, allowing it to counteract warpage specifically in the pressure chamber region without affecting the overall ink ejection mechanism.
Solution Approach 2:
The pressure chamber is constructed using composite material structures, combining the substrate with a warpage reducing layer made of different material properties. This composite structure leverages the complementary characteristics of the materials to achieve both ink ejection functionality and warpage resistance, ensuring uniform ejecting angles across the entire length of the ink jet head.
2Strength
If the substrate is made rigid to maintain structure, then mechanical strength is improved, but stress distortion and warpage increase leading to precision deterioration
Solution Approach 1:
Instead of making the entire substrate uniformly rigid, a warpage reducing layer is applied locally to the second face of the pressure chamber substrate. This localized approach provides the necessary rigidity and stress distribution specifically where needed to prevent warpage, while maintaining the overall flexibility and functionality of the ink ejection system.
Solution Approach 2:
The warpage reducing layer acts as an intermediary element between the substrate and the external environment. It mediates the mechanical stresses and thermal expansions, absorbing and distributing forces to prevent direct transmission of stress distortion to the nozzle structure, thereby maintaining precision in ink landing positions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures uniform ink ejecting angles and precise landing positions over the entire length, enhancing printing precision and preventing damage from internal stress distortion, thereby achieving high-quality prints and extending the lifespan of the ink jet heads.
Implementation Method 1
a driving unit which is provided on the vibrating plate, and includes a piezoelectric substance
Data Source
AI summary
According to one embodiment, there is provided an ink jet head which includes a pressure chamber which is formed in a thickness direction of a substrate, and fills ink; a vibrating plate which is provided on a first face of the pressure chamber, and includes a nozzle which communicates with the pressure chamber; a driving unit which is provided on the vibrating plate, and includes a piezoelectric substance; and a warpage reducing layer which is provided on a second face which is opposite to the first face of the pressure chamber, and reduces warpage of the substrate.


