Ink Jet Head Substrate Sheet Solder Adhesion Control
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Solution Overview
Problem
The existing manufacturing method for circuit substrates in ink jet heads faces issues with inconsistent solder adhesion, leading to connection failures due to insufficient or excessive solder amounts on external electrodes, and potential short-circuits caused by excess solder.
Innovation Solution
A substrate sheet design with external electrodes, extending conductors, and probing electrodes, where the width of the extending conductor is smaller than the external and probing electrodes, allowing for uniform solder adhesion and reducing the difference in solder amounts between electrode pairs, ensuring a sufficient conductive brazing material is applied.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the width of extending conductor is made equal to or larger than external electrodes, then solder adhesion area is increased, but solder amount becomes excessive causing short-circuits between adjacent electrodes
Solution Approach 1:
The extending conductor is designed with a width that is smaller than the external electrodes it connects. This local dimensional differentiation ensures that solder is confined to the electrode regions rather than spreading to adjacent electrodes, preventing short-circuits while maintaining sufficient solder adhesion at each connection point.
2Object-affected harmful factors
If the width of extending conductor is reduced, then solder adhesion amount is controlled, but connection reliability may be insufficient
Solution Approach 1:
The extending conductor width is specifically designed to be smaller than external electrode widths, creating a localized solder containment structure. This geometric configuration naturally restricts solder flow to the intended electrode region, ensuring both short-circuit prevention and adequate connection reliability through proper solder distribution.
3Measurement precision
If probing electrode width is increased for better conduction testing, then measurement capability is improved, but electrode spacing must be increased reducing productivity
Solution Approach 1:
The extending conductor is designed with a width smaller than both the external electrodes and probing electrodes. This creates distinct functional zones where probing electrodes can maintain sufficient width for reliable conduction testing, while the narrower extending conductor prevents solder from bridging to adjacent structures, enabling closer electrode spacing and higher production efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures excellent connections between external electrodes and recording heads by maintaining a necessary solder amount, preventing connection failures and short-circuits, while allowing for larger probing electrodes and closer electrode spacing.
Implementation Method 1
a conductive brazing material is adhered to the external electrodes
Data Source
AI summary
A plurality of external electrodes 11c, 11m are disposed in parallel along two sides facing each other of a region 300 corresponding to the circuit substrate to be manufactured, and a probing electrode is formed, which is connected to the external electrodes through extending conductors 13a, 13b extending to the outside the region 300 from the external electrodes. At this time, widths of the extending conductors 13a, 13b are set smaller than the widths of the external electrodes 11c, 11m and probing electrodes 12a, 12b. Therefore, a solder storage part is formed in a wide portion in a width changing part between an electrode and a conductor, and a necessary sufficient amount of solder is adhered to the surfaces of the external electrodes 11c, 11m.