Laser Sintering via Inkjet Absorber for Cost Reduction
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Solution Overview
Problem
Conventional laser sintering processes for rapid prototyping are expensive and require specialized, expensive CO2 lasers, limiting their accessibility and flexibility due to the need for complex mirror systems and trained operators, and cannot utilize lower-cost lasers of different wavelengths effectively.
Innovation Solution
A process using lasers with wavelengths from 100 to 3000 nm, where a specific absorber is selectively applied via an inkjet process to regions to be melted, allowing the use of less expensive lasers like diode lasers, and achieving precision and speed comparable to CO2 laser sintering by focusing energy through the absorber, enabling the production of three-dimensional objects with improved mechanical properties and reduced operational complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If CO2 laser is used for sintering polymer powder, then sintering effectiveness is achieved, but cost and operational complexity increase significantly
Solution Approach 1:
An absorber layer is introduced as an intermediary between the laser beam and the polymer powder. The absorber converts laser energy at wavelengths 100-3000 nm into heat, which then transfers to the powder for sintering. This mediator enables the use of simpler, lower-cost lasers that would otherwise be ineffective for direct polymer sintering.
Solution Approach 2:
The invention changes the wavelength parameter of the laser from the conventional CO2 range (10600 nm) to the 100-3000 nm range. This parameter change allows the use of diode lasers and other solid-state lasers that are cheaper and simpler to operate, while the absorber compensates for the reduced direct absorption by the polymer powder.
2Reliability
If CO2 laser with wavelength 10600 nm is used, then polymer powder can be sintered, but expensive specialized equipment is required
Solution Approach 1:
The absorber acts as an energy transfer intermediary that enables cheap lasers (wavelength 100-3000 nm) to effectively sinter polymer powder. The absorber absorbs the laser energy and converts it to heat, which then conducts to the powder, bypassing the need for expensive CO2 lasers that directly match polymer absorption bands.
Solution Approach 2:
The invention replaces expensive, specialized CO2 laser equipment with cheaper, commercially available diode lasers and solid-state lasers. The absorber layer (which can be a simple coating or printed pattern) serves as a disposable or reusable intermediate that enables the cheaper laser to perform the sintering function.
3Manufacturing precision
If laser beam is focused precisely, then sintering precision is improved, but processing speed decreases
Solution Approach 1:
The absorber is applied in advance to the regions where sintering is required. This preliminary action creates a spatial map of energy absorption, allowing the laser to scan more quickly without needing to slow down for precise focusing at each point. The absorber pattern pre-defines the sintering zones.
Solution Approach 2:
The invention allows dynamic adjustment of laser focusing based on absorber distribution. In regions with high absorber concentration, the laser can be less focused and move faster, while still achieving adequate energy delivery through the absorber's heat conversion. This dynamic approach balances precision and speed across different regions of the build area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The process allows for the production of three-dimensional objects with improved mechanical properties and reduced costs, using a range of lasers, including diode lasers, which are simpler and more flexible, enabling the incorporation of conductive regions or inks, and allowing for the use of a broader range of substrates.
Implementation Method 1
the electromagnetic energy needed for the melting of the substrate is generated via a laser of wavelength from 100 to 3000 nm, and is passed into an absorber, by way of which it is dissipated to the subregions of the substrate
Implementation Method 2
the electromagnetic energy needed for the melting of the substrate is generated via a laser of wavelength from 100 to 3000 nm
Implementation Method 3
The molten particles coalesce and solidify relatively rapidly again to give a solid mass
Data Source
AI summary
The present invention relates to a process for the bonding of material for the production of three-dimensional objects by selective heating via a laser of wavelength from 100 to 3000 nm. The beam spot may be a focused or unfocused beam spot, or may indeed be spread, as is the case with the diode laser, where the bars may have a stacked arrangement. The selectivity of the melting process is achieved via the application of an absorber to certain subregions of a layer composed of a pulverulent substrate, and then heating of the absorber by laser radiation of wavelength from 100 to 3000 nm. The heated absorber transfers the energy present therein to its surrounding pulverulent substrate, which is melted thereby and, after cooling, has firm cohesive bonding.