Ink Jet Adhesive Application for Electronic Component Manufacturing
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Solution Overview
Problem
Conventional methods for producing semiconductor devices face challenges such as long tact time, low thickness accuracy, protrusion of adhesive layers, and reduced adhesion reliability due to uneven curable composition application, particularly when using dispensers or screen printing.
Innovation Solution
A method involving the application of a photocurable and thermocurable adhesive using an ink jet device, followed by controlled light irradiation and heating to form a precise adhesive layer, ensuring accurate curing and attachment of electronic component bodies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a curable composition is applied by dispenser or screen printing, then the adhesive layer can be formed, but the thickness accuracy is low and the application is uneven
Solution Approach 1:
The patent replaces the mechanical dispensing or screen printing system with an ink jet application system. The ink jet device deposits curable composition droplets precisely at predetermined positions and in predetermined amounts, eliminating the thickness control issues inherent in mechanical dispensing methods while maintaining ease of manufacture through automated deposition.
Solution Approach 2:
The patent applies curable composition with locally controlled properties - each droplet is deposited with precise volume and position control. The ink jet system enables different deposition parameters (volume, frequency, pattern) to be applied locally across different regions of the adhesive layer, achieving uniform thickness and eliminating protrusions while maintaining manufacturing simplicity.
2Productivity
If conventional curable composition application methods are used, then the adhesive layer can be formed, but the tact time is long making production inefficient
Solution Approach 1:
The patent implements continuous useful action by combining ink jet deposition with immediate irradiation curing in a streamlined sequence. The ink jet device deposits composition and the irradiation unit cures it in succession without interruption, eliminating waiting time between application and curing operations. This continuous process significantly reduces tact time compared to conventional batch methods while increasing production efficiency.
3Reliability
If conventional application methods are used, then the adhesive layer can be formed, but voids form due to poor surface smoothness
Solution Approach 1:
The patent replaces mechanical application methods that create surface irregularities with ink jet deposition that places precise droplets. This substitution eliminates the sweeping and scraping actions that cause voids and surface roughness, resulting in smooth adhesive layers with excellent adhesion reliability and no void formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of a cured adhesive layer with high accuracy, improving adhesion reliability and reducing voids and protrusions, thus enhancing the efficiency and quality of semiconductor device production.
Implementation Method 1
a circulation flow path part that is connected to the discharge part at one end and connected to the ink tank at the other end, through which the adhesive flows
Implementation Method 2
a first light irradiation step in which, after the application step, the adhesive layer is irradiated with light from a first light irradiation part to allow the curing of the adhesive layer to proceed
Implementation Method 3
a heating step in which, after the attachment step, the primary laminate is heated to cure the adhesive layer between the first electronic component body and the second electronic component body
Data Source
Figure 1(a)~1(e)
Figure 2~3
Figure 4~5
AI summary
Provided is a method for producing an electronic component, which is capable of forming a cured adhesive layer easily with high accuracy. The method for producing a curable film electronic component according to the present invention includes an application step in which an adhesive is applied onto a first electronic component body using an ink jet device to form an adhesive layer, a first light irradiation step in which an adhesive layer is irradiated with light from a first light irradiation part, an attachment step in which a second electronic component body is disposed on the adhesive layer irradiated with light and attached, and a step in which the adhesive layer is cured by heating, thereby giving an electronic component, the ink jet device includes an ink tank to store the adhesive, a discharge part, and a circulation flow path part, and in the application step, the adhesive is applied while being circulated in the ink jet device.