Heat-Conductive Chassis for Inkjet IC Thermal Management
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Solution Overview
Problem
Inkjet devices face issues with ink mist causing short circuits and corrosive malfunctions due to ink mists adhering to integrated circuits and circuit boards, and hermetic sealing retains heat, potentially damaging the integrated circuit.
Innovation Solution
The use of heat-conductive chassis and support structures to dissipate heat generated by the integrated circuit, combined with a hermetically sealed chassis to prevent ink mist from entering, facilitates efficient heat transfer and prevents ink mist from adhering to electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the integrated circuit is hermetically sealed to prevent ink mist from entering, then reliability is improved, but heat dissipation is hindered causing temperature to rise
Solution Approach 1:
A heat-conductive member is introduced as an intermediary between the integrated circuit and the external environment. This member has high thermal conductivity to conduct heat away from the integrated circuit, while its low solubility in ink and chemical inertness prevent ink mist from penetrating to the circuit, thus resolving the contradiction between heat dissipation and ink mist protection
Solution Approach 2:
The sealing structure uses composite material properties: the heat-conductive member combines high thermal conductivity with chemical inertness and low ink solubility. This composite functionality allows simultaneous achievement of heat dissipation and ink mist barrier functions, resolving the contradiction between temperature control and reliability
2Object-affected harmful factors
If the integrated circuit is hermetically sealed to prevent ink mist, then resistance to harmful factors is improved, but heat conduction is reduced
Solution Approach 1:
The heat-conductive member serves as a mediator that blocks ink mist from reaching the integrated circuit while simultaneously conducting heat away from it. The member's positioning between the circuit and external environment allows it to fulfill both protective and thermal management functions
Solution Approach 2:
The invention changes the material parameters of the sealing structure by selecting a heat-conductive member with high thermal conductivity and low ink solubility. This parameter optimization allows the member to effectively conduct heat while resisting ink penetration, resolving the contradiction between heat conduction and harmful factor resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents ink mist from causing short circuits and corrosive damage while efficiently dissipating heat, thereby protecting the integrated circuit and maintaining the integrity of the inkjet device's performance.
Implementation Method 1
a heat-conductive chassis to which the plurality of nozzles, the plurality of pressure chambers, and the plurality of actuators are mounted, an integrated circuit held inside the chassis and configured to drive the actuators to eject liquid from the plurality of nozzles, a circuit board electrically connected to the integrated circuit and configured supply an electrical signal to integrated circuit, and a heat-conductive support to which the circuit board is mounted, the heat-conductive support held by the heat-conductive chassis to contact the integrated circuit and an inner surface of the heat-conductive chassis
Data Source
AI summary
A liquid jetting device includes a plurality of nozzles from which a liquid can be ejected, a plurality of pressure chambers, each being in fluid communication with an associated nozzle in the plurality of nozzles, actuators associated with each pressure chamber and configured to cause a pressure change in an associated pressure chamber in the plurality of pressure chambers, a heat-conductive chassis to which the plurality of nozzles, the plurality of pressure chambers, and the actuators are mounted, an integrated circuit held inside the chassis and configured to drive the actuators to eject liquid from the plurality of nozzles, a circuit board electrically connected to the integrated circuit and configured supply an electrical signal to integrated circuit, and a heat-conductive support to which the circuit board is mounted, the heat-conductive support held by the heat-conductive chassis to contact the integrated circuit and an inner surface of the heat-conductive chassis.