Inkjet Chip Structure With Integrated Heating And Conductive Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional inkjet chip structures suffer from structural weaknesses at the junction of the heating resistance layer and conductive layer, leading to cracks, poor mechanical strength, and reduced reliability due to the two-layer inclined step structure, affecting printing performance and production yield.
Innovation Solution
The integration of the heating resistance layer and conductive layer on the same layer, with a protective layer formed subsequently to eliminate the step phenomenon, and the incorporation of a dielectric layer to encapsulate and recesses to enhance structural integration and energy efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conductive layer and heating resistance layer are plated by sputtering to form a two-layer inclined step structure, then the electrical energy can be provided to the heating resistance layer, but the structural strength and reliability deteriorate due to stress concentration and poor step coverage
Solution Approach 1:
The patent merges the conductive layer and heating resistance layer into a single integrated layer structure, eliminating the interface between two separate layers. This integration removes the source of stress concentration and step coverage problems, thereby improving both mechanical strength and reliability simultaneously.
2Reliability
If the two-layer inclined step structure is formed at the junction of conductive layer and heating resistance layer, then the electrical connection is established, but cracks and holes容易产生 at the junction due to poor physical mechanical strength
Solution Approach 1:
By combining the conductive and heating resistance functions into one continuous layer, the patent eliminates the junction interface where cracks and holes would form. The integrated structure provides uniform stress distribution and eliminates the harmful effects of layer interfaces.
3Strength
If the protective layer is formed over the two-layer inclined step structure, then the structural protection is provided, but the protective layer cracks due to the underlying step structure
Solution Approach 1:
The integration of conductive and heating resistance layers into a single layer eliminates the step structure that causes stress concentration. This allows the protective layer to be formed over a smooth, continuous surface, preventing cracks and maintaining both structural protection and layer integrity.
4Ease of manufacture
If the conventional two-layer structure is used, then the manufacturing process is established, but the production yield is reduced due to poor service life and reliability
Solution Approach 1:
The patent simplifies the manufacturing process by forming a single integrated layer instead of two separate layers, reducing process complexity and variability. This integration eliminates the need for precise alignment and interface control, thereby improving production yield while maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves mechanical strength, service life, and reliability of the inkjet chip structure, while optimizing energy consumption and production yield, maintaining high-quality printing performance and reducing manufacturing costs.
Implementation Method 1
the conductive layer 105 provides the electrical energy to the heating resistance layer 106, so that the ink in the ink supply chamber 102 is heated to generate bubbles
Data Source
AI summary
The present disclosure provides an chip structure. The inkjet chip structure includes a substrate layer, a heating resistor, and a protective layer. The heating resistor is disposed on the substrate layer. The protective layer covers the heating resistor. The heating resistor includes a heating resistance layer and a dielectric layer. The protective layer includes a plurality of recesses disposed above the dielectric layer. A distance is formed from a bottom of the recess to a top of the heating resistance layer, and the distance is ranged from 1.5×10−7 m to 1.4×10−6 m. In addition, a contact layer is arranged around the heating resistance layer. The contact layer is rectangular in shape when viewed from a top view. There are at least two contact layers in each direction from the heating resistance layer, and all the contact layers have one side length with a fixed size.