Integrated Inkjet Chip Wafer Structure for High Resolution Printing
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Solution Overview
Problem
The manufacturing cost of inkjet chips is high due to the need for additional processes and precise alignment in conventional semiconductor processes, limiting the number of chips that can be produced on a limited wafer area, which is wasteful and does not support higher resolution and higher printing speed requirements.
Innovation Solution
A wafer structure with a silicon substrate fabricated by a semiconductor process, where multiple inkjet chips with different printing swath sizes are directly formed, each containing integrally formed ink-drop generators with an ink-supply chamber and nozzle in a barrier layer, allowing for higher resolution and performance while reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional semiconductor process is used to manufacture inkjet chips with separate nozzle plates, then the nozzle can be produced with precise alignment, but the manufacturing process complexity increases and manufacturing cost increases
Solution Approach 1:
The patent merges the nozzle structure and ink-supply chamber into a single integrated component fabricated directly on the chip substrate using semiconductor processes. This eliminates the separate nozzle plate and reduces the number of assembly steps while maintaining precise alignment through monolithic fabrication.
Solution Approach 2:
The chip substrate serves multiple functions: it acts as the structural base, the fabrication platform for ink-drop generators, and the integration platform for electrical components. This multi-functionality reduces the need for separate components and simplifies the overall manufacturing process.
2Manufacturing precision
If conventional semiconductor process with separate nozzle plates is used, then the nozzle can be precisely aligned to the ink-supply chamber, but the manufacturing cost increases
Solution Approach 1:
The nozzle and ink-supply chamber are combined into a single integrated structure fabricated in one semiconductor process run, eliminating the need for separate nozzle plate fabrication and alignment operations, thereby reducing manufacturing cost while maintaining precision.
Solution Approach 2:
The nozzle structure is pre-formed as part of the barrier layer during the semiconductor fabrication process before final chip assembly, ensuring precise alignment is built-in during fabrication rather than requiring post-fabrication alignment operations.
3Productivity
If wafer structure of less than 6 inches is used, then the manufacturing process is manageable, but the number of inkjet chips per wafer is limited and manufacturing cost cannot be effectively reduced
Solution Approach 1:
The wafer is segmented into multiple identical chip regions, each containing complete inkjet chip structures. This allows systematic arrangement and optimization of chip density on the wafer surface, maximizing the number of chips per wafer while maintaining manufacturability.
4Measurement precision
If printing swath is increased to achieve higher resolution and printing speed, then the printing quality improves, but the overall area required for the inkjet chip increases
Solution Approach 1:
The patent extends the printing swath primarily in the longitudinal direction rather than increasing the overall chip area uniformly. This dimensional optimization allows higher resolution and printing speed while minimizing the increase in total chip area, thereby improving wafer utilization.
Data Source
AI summary
A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip. The chip substrate is a silicon substrate fabricated by a semiconductor process. The inkjet chip is directly formed on the chip substrate by the semiconductor process, whereby the wafer structure is diced, and the inkjet chip is produced, to be implemented for inkjet printing. The inkjet chip includes a plurality of ink-drop generators produced by the semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a barrier layer, an ink-supply chamber and a nozzle, and the ink-supply chamber and the nozzle are integrally formed in the barrier layer.