Inkjet Encapsulating Composition for Thin OLED Moisture Barriers
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Solution Overview
Problem
Organic electronic devices, such as OLEDs, are susceptible to oxidation and moisture penetration, leading to durability issues and requiring effective encapsulation to enhance their lifespan and performance.
Innovation Solution
An encapsulating composition comprising specific monomers, crosslinking agents, and additives, designed for inkjet application, forms a thin, low dielectric constant layer that provides moisture and oxygen barrier properties, ensuring excellent curing sensitivity and adhesive strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional encapsulation methods are used to block moisture and oxygen, then durability is improved, but device thickness increases and dielectric constant characteristics deteriorate
Solution Approach 1:
The patent employs an organic encapsulation layer with thickness of 1-20 μm that provides effective moisture and oxygen barrier properties. This thin film approach maintains device durability while minimizing thickness increase, directly resolving the contradiction between protection and thinness.
Solution Approach 2:
The encapsulation layer is formulated as a composite organic material system with specific molecular structures (including siloxane groups and aromatic rings) that provides both barrier functionality and low dielectric constant characteristics, achieving multiple functions in a single thin layer.
2Object-affected harmful factors
If thicker encapsulation layers are used to improve barrier properties, then moisture blocking is improved, but dielectric constant increases and display performance deteriorates
Solution Approach 1:
The patent changes the chemical composition parameters of the encapsulation layer by incorporating specific functional groups (siloxane, aromatic rings) and controlling molecular weight distribution, achieving high barrier performance with low dielectric constant in a thin layer configuration.
Solution Approach 2:
The thin film design (1-20 μm) with optimized composition provides sufficient moisture blocking capability without requiring increased thickness, thereby maintaining low dielectric constant and excellent display characteristics.
3Object-affected harmful factors
If traditional encapsulation materials are used, then barrier properties are improved, but adhesive strength to organic electronic elements deteriorates
Solution Approach 1:
The encapsulation layer formulation incorporates specific functional groups (siloxane groups, aromatic rings) that provide localized adhesive functionality at the interface with organic electronic elements, while maintaining overall barrier properties and low dielectric constant throughout the layer.
Solution Approach 2:
The multi-component organic encapsulation system combines materials with complementary properties: some components provide barrier functionality, others provide adhesive characteristics, achieving both strong bonding and effective protection.
4Duration of action of stationary object
If encapsulation layers are applied to protect organic electronic devices, then lifetime is improved, but manufacturing complexity increases
Solution Approach 1:
The organic encapsulation layer serves multiple functions simultaneously: moisture barrier, oxygen barrier, adhesive bonding, and electrical insulation. This multi-functionality in a single layer simplifies the overall encapsulation structure while extending device lifetime.
Solution Approach 2:
The formulated organic encapsulation material integrates multiple functional components into a single application layer, providing comprehensive protection without requiring multiple separate encapsulation layers, thereby reducing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The encapsulating composition effectively blocks moisture and oxygen, enabling a long lifespan for organic electronic devices, supports top-emitting designs, and maintains low dielectric constants, suitable for thin displays.
Implementation Method 1
the encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside
Implementation Method 2
can provide a thin display having low dielectric constant characteristics
Data Source
Figure 1~2
AI summary
The present disclosure relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, can implement a top-emitting organic electronic device, can be applied in an inkjet method and can provide a thin display having low dielectric constant characteristics.