Inkjet Head Substrate Layout for Shared Heater Array Inputs
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Solution Overview
Problem
The increase in the number of data input terminals on inkjet print head substrates due to multiple heater arrays leads to increased current consumption, larger substrate and wiring board sizes, and reduced reliability due to increased sealing regions.
Innovation Solution
A head substrate design that includes one or more first reception units for communication data on multiple arrays and a second reception unit for a single array, reducing the number of data input terminals by dividing communication data into separate units for multiple and single heater arrays, thereby minimizing the number of input circuits and electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of heater arrays is increased, then the printing capability and resolution are improved, but the number of data input terminals increases leading to higher current consumption and larger substrate size
Solution Approach 1:
The patent merges the control of multiple heater arrays by using a single data input terminal that receives communication data containing heater selection information for multiple arrays. This consolidates what would traditionally require separate terminals for each array into one shared terminal, reducing the overall number of terminals while maintaining the ability to control multiple arrays for improved printing capability.
Solution Approach 2:
The single data input terminal is designed to serve multiple heater arrays universally. The communication data format enables this terminal to receive instructions for selecting and controlling heaters across multiple arrays, making the terminal multi-functional rather than dedicated to a single array, thus reducing terminal count while supporting enhanced printing capabilities.
2Productivity
If the number of heater arrays is increased, then the printing capability and resolution are improved, but the substrate size and wiring board size increase
Solution Approach 1:
The patent combines the data input functions for multiple heater arrays into a single terminal location on the substrate. This merging approach means that instead of having separate terminals distributed across the substrate for each array, all control data for multiple arrays are received through one terminal, thereby reducing the overall area occupied by terminals and wiring while maintaining the ability to control multiple arrays for improved printing capability.
3Productivity
If the number of heater arrays is increased, then the printing capability is improved, but the number of sealing regions increases reducing reliability
Solution Approach 1:
The patent merges the data input terminals for multiple heater arrays into a single terminal, which directly reduces the number of sealing regions required. Fewer sealing regions mean fewer potential failure points for sealant protection, thereby improving reliability while still supporting multiple heater arrays for enhanced printing capability through the shared communication data structure.
Data Source
AI summary
A head substrate including a plurality of arrays in each of which a plurality of liquid ejection heads for ejecting a liquid and a plurality of heaters are disposed, includes: one or more first reception units configured to receive communication data including heater selection data on a plurality of arrays, the heater selection data being for selecting the heaters; and one second reception unit configured to receive communication data including heater selection data on a single array and setting data.