Inkjet Head Chip Bonding Defect Detection via Intermediate Plate Through Holes
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Solution Overview
Problem
The existing inkjet head technology faces challenges in maintaining printing quality due to bonding defects between the intermediate plate and the nozzle plate, which can cause ink supply hindrances and jet direction deviations, especially when using opaque materials like metals, making it difficult to detect bonding defects optically.
Innovation Solution
A head chip configuration with an actuator plate, intermediate plate, and jet orifice plate, where the intermediate plate has communication holes and through holes that allow detection of bonding defects by vacuuming the jet channel with blocked nozzle holes, and the through holes are strategically positioned to avoid electrode interference and reduce processing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an intermediate plate is introduced between the actuator plate and nozzle plate to allow displacement, then the allowable displacement range increases and nozzle hole blocking is prevented, but bonding defects can cause ejection channel communication and jet direction deviation
Solution Approach 1:
The patent introduces a detection channel as an intermediary element that connects to the ejection channel through a communication hole in the intermediate plate. This detection channel acts as a mediator to detect bonding defects between the intermediate plate and nozzle plate by allowing ink leakage to be observed at the detection hole, thereby resolving the reliability issue while maintaining the displacement adaptability provided by the intermediate plate.
2Strength
If the nozzle plate is formed of opaque material such as metal, then durability and structural strength are improved, but optical detection of bonding defects becomes difficult
Solution Approach 1:
The patent segments the detection function from the nozzle plate by introducing a separate detection channel and detection hole structure. This allows the nozzle plate to be made of opaque material for strength while the detection channel provides a separate optical path for defect detection, resolving the contradiction between material strength and detectability.
Solution Approach 2:
The detection channel serves as an intermediary structure that enables defect detection without requiring the nozzle plate itself to be transparent. The communication hole in the intermediate plate acts as a mediator to connect the detection channel with the ejection channel, allowing optical detection while maintaining the opaque nozzle plate structure.
3Reliability
If through holes are formed in the intermediate plate for detection purposes, then bonding defects can be detected, but processing time and complexity increase
Solution Approach 1:
The patent merges the detection hole formation with existing manufacturing processes by forming the detection hole together with the communication hole in the intermediate plate. This integration reduces the number of separate processing steps and minimizes manufacturing time while maintaining the ability to detect bonding defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the detection of bonding defects, preventing printing quality deterioration and maintaining electrode reliability by allowing for the detection of leaks and improving fabrication yield through precise through hole formation.
Implementation Method 1
by vacuuming the jet channel with the jet orifice blocked... detecting the leakage
Data Source
AI summary
The head chip includes an actuator plate having ejection channels and non-ejection channels extending in a Y direction and arranged alternately in an X direction, an intermediate plate overlapped with the actuator plate in a Z direction, and provided with communication holes communicated with the ejection channels and through holes communicated with the non-ejection channels, and a nozzle plate overlapped with the intermediate plate in the Z direction in a state of closing the through holes, and provided with nozzle holes which are communicated with the communication holes, jet liquid contained in the ejection channels, and are formed at positions corresponding to the ejection channels. The non-ejection channels are communicated with an outside of the head chip. The through holes are each disposed at an inner side in the X direction of the inner surfaces extending in the Y direction of the non-ejection channel viewed from the Z direction.


