Inkjet Head Cooling Jacket Layout for Compact Heat Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional inkjet printing devices face challenges in achieving downsizing while effectively managing high-temperature heat generated by the drive substrate, which can affect the recording heads and hinder efficient layout.
Innovation Solution
The inkjet head design includes a detachable drive substrate unit that overlaps with the ejector unit, featuring a cooling jacket to suppress heat propagation, and an ejector unit with openings aligned with the base plate for efficient ink supply.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the drive substrate is widely separated from the recording heads to prevent heat propagation, then the heat generated by the drive substrate can escape to the outside through the case and heat exchanger plate, but it becomes difficult to achieve downsizing of the entire recording device and enough layout space may not be ensured
Solution Approach 1:
The cooling jacket is arranged between the drive substrate and the inner surface of the case, nesting the cooling structure within the existing device boundaries. This allows heat management without increasing overall device volume, as the cooling jacket utilizes the space already available between internal components and the case wall.
Solution Approach 2:
The cooling jacket acts as an intermediary element between the heat-generating drive substrate and the case. It mediates heat transfer by providing a controlled thermal pathway through the cooling medium, preventing direct heat propagation to the ejector unit while managing thermal energy within the compact device structure.
2Temperature
If the drive substrate is widely separated from the recording heads to prevent heat affecting the recording heads, then heat can escape through the case and heat exchanger plate, but the device complexity increases and layout space is reduced
Solution Approach 1:
The cooling jacket serves multiple functions: it acts as a thermal management component for the drive substrate, provides structural support within the device, and defines part of the internal layout geometry. This multi-functionality reduces overall device complexity by combining what would otherwise be separate components.
Solution Approach 2:
The cooling jacket is integrated with the case structure, merging the cooling function with the housing component. This integration reduces the number of separate parts and simplifies the overall device architecture while maintaining effective heat management.
3Ease of operation
If the drive substrate unit is made detachable from the ejector unit for easier maintenance and layout flexibility, then the device can be configured in compact arrangements, but the connection reliability between connectors may be affected
Solution Approach 1:
The device is divided into detachable units (drive substrate unit and ejector unit) that can be separated for maintenance and reconfigured for different layouts. The segmentation is designed with standardized connectors that maintain reliable electrical connections while allowing easy assembly and disassembly operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves downsizing of the inkjet head while effectively managing heat, ensuring the drive substrate and ejector unit operate efficiently without heat interference.
Implementation Method 1
a cooling jacket that cools the drive substrate by passing a cooling medium therein
Data Source
AI summary
An inkjet head includes an ejector unit that ejects ink in accordance with a driving signal and a drive substrate unit that outputs the driving signal. The drive substrate unit includes a drive substrate that generates the driving signal, a case that holds the drive substrate, a cooling jacket, and a connection port connected to the cooling jacket. The cooling jacket is arranged between the drive substrate and the inner surface of the case and cools the drive substrate by passing a cooling medium therein. The connection port is formed in the side wall or the top plate of the case. At least part of the connection port is located in the vicinity of the top plate. This configuration achieves downsizing of the entire inkjet head including the ejector unit and the drive substrate unit including the drive substrate, and also suppresses propagation of high-temperature heat generated by the drive substrate to the ejector unit.