Inkjet Head Module Distance Measurement for Substrate Adhesion
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Solution Overview
Problem
The existing methods for processing glass substrates in display device manufacturing, such as LCD or LED panel production, face challenges when changing production models, leading to adhesion errors due to variations in levitation amounts and stand-off distances.
Innovation Solution
A method and apparatus that involve measuring the distance between the substrate and the inkjet head module, monitoring the levitation amount of the substrate, and adjusting the discharging speed and amount of ink based on these measurements to maintain consistent adhesion during changes in production models.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual adjustment of levitation amount is performed when production model is changed, then adhesion error is prevented, but production amount decreases due to facility stop
Solution Approach 1:
The system automatically measures the stand-off distance using a distance sensor and adjusts the ink discharging speed without operator intervention. The controller receives the measured distance and autonomously modifies printing parameters to maintain adhesion accuracy, enabling the system to serve itself during production model changes.
Solution Approach 2:
The distance sensor continuously measures the stand-off distance between the inkjet head and substrate, providing real-time feedback to the controller. Based on this feedback, the controller dynamically adjusts the ink discharging speed to compensate for distance variations, ensuring consistent adhesion quality across different production models.
2Productivity
If automatic distance-based speed adjustment is implemented, then production amount is maintained, but device complexity increases
Solution Approach 1:
The manual mechanical adjustment process is replaced with an automated system combining a distance sensor (optical/electronic measurement) and a controller that electronically adjusts the ink discharging speed. This substitution eliminates manual intervention while maintaining adhesion quality, though it introduces additional electronic components.
Solution Approach 2:
The system changes the ink discharging speed parameter based on measured stand-off distance variations. By dynamically adjusting this critical printing parameter, the system compensates for distance changes without requiring mechanical modifications to the levitation stage or inkjet head positioning.
Data Source
AI summary
The present disclosure provides a method for processing a substrate that can maintain a production amount even when a production model is changed. The method for processing a substrate comprises: disposing the substrate on a levitation stage; measuring a distance between the substrate and an inkjet head module; and changing a discharging speed of ink to be discharged from the inkjet head module based on the measured distance.