Inkjet Head Flow Path Substrate Corrosion Prevention

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Solution Overview

Problem

The existing inkjet head manufacturing methods fail to effectively prevent corrosion of the flow path substrate due to ink adherence on the split faces exposed during the splitting process, leading to potential ink leakage and supply issues.

Innovation Solution

The method involves forming a first protective film on the surfaces and inner walls of the ink flow paths of the nozzle and flow path substrates before splitting, and then applying a second protective film on the exposed split faces to prevent ink corrosion, ensuring the inkjet head's components remain functional.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a protective film is formed on the surface of flow path substrate and inner wall surfaces of ink flow paths before splitting, then corrosion resistance is improved, but the split face remains unprotected leading to potential ink corrosion

Engineering Contradiction:
Improvecorrosion resistanceVSAvoidink corrosion on split face
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A protective film is formed on the flow path substrate and inner wall surfaces of ink flow paths before the substrate is split into individual flow path substrates. This preliminary protective action ensures that the bulk surfaces are protected during subsequent processing and assembly operations.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

After splitting the flow path substrate, a second protective film is selectively formed only on the exposed split faces. This local quality approach applies protection precisely where needed (the vulnerable split surfaces) without unnecessarily coating other areas, thereby preventing ink corrosion at the specific location where the substrate is most susceptible to damage.

Inventive Principle:
Principle #3Local quality

2Productivity

If composite substrate is split into multiple flow path substrates, then manufacturing efficiency is improved, but split faces are exposed to ink corrosion

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidcorrosion protection
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The protective film is formed on the composite substrate before splitting, protecting the surfaces that will be exposed during the splitting process. This preliminary protection maintains reliability while enabling efficient batch processing of multiple flow path substrates.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The second protective film is applied selectively to the split faces after splitting. This localized approach ensures that the corrosion protection is applied precisely where the splitting process creates vulnerability, maintaining reliability without compromising the manufacturing efficiency of the batch processing approach.

Inventive Principle:
Principle #3Local quality

Data Source

PatentEP3733415B1Inkjet head manufacturing method, inkjet recording device manufacturing method, inkjet head, and inkjet recording device
Publication Date: 2023.01.25 KONICA MINOLTA INC
  • EP3733415B1 patent drawingFigure 1~2
  • EP3733415B1 patent drawingFigure 3
  • EP3733415B1 patent drawingFigure 4

AI summary

The purpose of the present invention is to enable a more reliable prevention of flow path substrate corrosion caused by ink. The manufacturing method for an inkjet head (100) provided with a head chip (10) including a flow path substrate (12) that has a nozzle (111) for discharging ink and an ink flow path (121) communicating with the nozzle and wherethrough the ink flows, comprises: a composite substrate manufacturing step for manufacturing a composite substrate (12M) having a plurality of regions that form flow path substrates by means of being split; a first protective film-forming step for forming a first protective film (71a) on the surface of the composite substrate and the interior wall face of the ink flow path; a splitting step for splitting off each of the flow path substrates from the composite substrate; and a second protective film-forming step for forming a second protective film (72) on at least the exposed faces that are exposed on the head chip surface, from among the split faces of the flow path substrates that arose during the splitting step.