Low-Temperature Curing Adhesive for Inkjet Heads
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Solution Overview
Problem
Current adhesive agents for inkjet heads fail to provide sufficient resistance against solvent-based inks while maintaining flexibility and low-temperature curing, leading to potential cracks, distortions, and peeling issues due to differences in thermal expansion coefficients among components.
Innovation Solution
A novel adhesive agent comprising a base of bisphenol F or bisphenol A epoxy compounds mixed with epoxy compounds having three or more epoxy groups, combined with a polyamide activator containing alicyclic polyamine, and fine particles, which is cured at low temperatures to reduce stress between components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive agent is cured under high temperature to enhance resistance against solvent-based ink, then resistance against solvent-based ink is improved, but stress between cured adhesive agent and members increases due to shrinkage difference, causing cracks, distortions, or peeling
Solution Approach 1:
The patent changes the curing temperature parameter from high temperature to low temperature (room temperature or slightly elevated), which reduces the shrinkage difference between the adhesive agent and members, thereby minimizing stress and preventing cracks and distortions while still achieving sufficient solvent resistance through the specific chemical composition of the adhesive agent
Solution Approach 2:
The patent uses a composite adhesive agent formulation combining epoxy compound with specific activators (polyamide and alicyclic polyamine) in controlled ratios, creating a material that achieves both low-temperature curing and adequate solvent resistance through the synergistic effect of multiple chemical components
2Strength
If adhesive agent is cured in low temperature close to environment temperature to reduce stress, then stress between members is reduced, but resistance against solvent-based ink becomes insufficient
Solution Approach 1:
The patent modifies the chemical composition parameters of the adhesive agent by selecting specific epoxy compounds and activators with optimized molecular structures and ratios, enabling the material to achieve adequate crosslinking density and solvent resistance even at low curing temperatures
Solution Approach 2:
The patent formulates a composite adhesive system combining epoxy base with polyamide and alicyclic polyamine activators in specific proportions (5-200 parts by mass of alicyclic polyamine with respect to 100 parts by mass of polyamide), creating a material that achieves both low-temperature curing and sufficient solvent resistance through the combined properties of multiple components
3Strength
If adhesive agent is made flexible to prevent cracks and distortions, then stress resistance is improved, but resistance against solvent-based ink becomes insufficient
Solution Approach 1:
The patent adjusts the crosslinking density parameter by controlling the ratio and type of activators used, achieving an optimal balance where the adhesive agent maintains sufficient flexibility to accommodate thermal expansion differences while developing adequate crosslinking to resist solvent-based ink
Solution Approach 2:
The patent creates a composite adhesive formulation where the polyamide and alicyclic polyamine activators work synergistically with the epoxy compound to produce a material that combines flexibility (preventing cracks) with solvent resistance through the specific chemical crosslinking structure created by the activator mixture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive agent effectively prevents cracks, distortions, and peeling by maintaining flexibility and resistance against solvent-based inks, ensuring reliable inkjet head performance and durability.
Implementation Method 1
the adhesive agent is preferably epoxy-based adhesive agent cross-linked under high temperature
Implementation Method 2
when adhesive agent is cured under high temperature, stress exerts between the cured adhesive agent and the members due to shrinkage difference between the members, because the members have different shrinkage factors when the temperature of the adhesive agent returns to a room temperature after the curing
Data Source
AI summary
Disclosed is an adhesive agent which is curable and has flexibility at low temperature, and further has resistant to solvent type ink. The adhesive agent includes a base and an activator, wherein the base includes at least any one of: bisphenol F epoxy compound; bisphenol F epoxy compound mixed with an epoxy compound having three or more epoxy groups; and bisphenol A epoxy compound mixed with an epoxy compound having three or more epoxy groups, wherein the activator includes: 100 parts by mass of polyamide composed of a condensation reaction product of C36 unsaturated fatty acid dimer and polyamine; and 5 to 200 parts by mass of alicyclic polyamine, and wherein the base is mixed with the activator with a ratio of 10 to 200 parts by mass of the activator with respect to 100 parts by mass of the base.