Inkjet Head Manifold Integration for Heat Dissipation
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Solution Overview
Problem
Conventional inkjet printer designs are not optimized for downsizing in the scanning direction, leading to inefficiencies in heat dissipation and liquid flow path management.
Innovation Solution
The design integrates the head chip and drive board on a manifold with a liquid flow path, allowing for compactness and enhanced heat dissipation, while a damper and nozzle plate are strategically positioned to improve printing characteristics and accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the manifold and drive board are separately disposed at opposite sides of the head chip in the scanning direction, then the heat dissipation path is established, but the inkjet head size in the scanning direction increases
Solution Approach 1:
The manifold is designed to support both the head chip and drive board on its upper surface, merging the functions of separate support structures. This integration allows the manifold to serve as a common platform for both components while its lower surface provides the heat dissipation path, thereby reducing the overall inkjet head size in the scanning direction while maintaining effective heat dissipation.
Solution Approach 2:
The heat dissipation function is shifted from the scanning direction (horizontal) to the thickness direction (vertical) by configuring the manifold to dissipate heat through its lower surface. This dimensional transition allows the head chip and drive board to be closely positioned in the scanning direction without compromising heat dissipation performance.
2Stability of the object's composition
If the head chip and drive board are supported on separate members, then the structural stability is maintained, but the device complexity increases
Solution Approach 1:
The manifold is designed to support both the head chip and drive board on its upper surface, merging the functions of separate support structures. This integration reduces the number of support members from two separate structures to one unified manifold, thereby reducing device complexity while maintaining structural stability through the manifold's rigid construction and strategic support points.
3Loss of time
If the manifold is positioned closer to the head chip, then the liquid flow path length is reduced, but the heat dissipation efficiency decreases
Solution Approach 1:
The manifold is configured to simultaneously achieve short liquid flow paths and effective heat dissipation by integrating both functions into a single component structure. The upper surface of the manifold provides support for the head chip and drive board, while the lower surface is optimized for heat dissipation, allowing the manifold to be positioned close to the head chip without compromising heat dissipation efficiency.
Solution Approach 2:
The heat dissipation function is transitioned to the thickness direction of the manifold, perpendicular to the liquid flow path direction. This allows the liquid flow path to be shortened in the scanning direction while heat dissipation occurs through the manifold's lower surface in the thickness direction, thereby resolving the trade-off between flow path length and heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables downsizing of the inkjet head, improves heat dissipation, and ensures reliable ink temperature control, resulting in enhanced printing performance and accuracy.
Implementation Method 1
heat generated in the head chip and the drive board is dissipated through the vertical base
Implementation Method 2
liquid flowing through the liquid flow path can be heated using exhaust heat which is generated in the head chip and drive board and transmitted to the manifold
Data Source
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AI summary
A liquid jet head includes: a nozzle plate including a nozzle array, the nozzle array including a plurality of nozzle holes each extending in a Z direction, the nozzle holes being arranged side by side in an X direction; a head chip disposed in a +Z direction with respect to the nozzle plate and including ejection channels communicating with the respective nozzle holes; a manifold disposed in a +Y direction with respect to the head chip, the manifold being configured to support the head chip by a face facing a -Y direction and including an ink flow path communicating with the ejection channels; and a drive board supported on the face facing the -Y direction of the manifold and electrically connected to the head chip.