Inkjet Head Module Positioning Adjustment Mechanism

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing methods for positioning head modules in ink jet recording apparatuses face challenges such as high accuracy requirements for convex and concave portions, thermal expansion issues, increased component counts, and time-consuming mounting processes, particularly when using connecting fittings.

Innovation Solution

A droplet-discharging head with a base frame, head module support unit, mounting position adjustment unit, and displacement detection unit allows for precise adjustment and detection of head module positions, enabling easy fine-tuning and high-accuracy mounting without the need for complex fitting systems.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If connecting fittings are used to connect head modules, then the head modules can be assembled, but the number of components increases and mounting time increases

Engineering Contradiction:
Improvehead module assemblyVSAvoidnumber of components
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The mounting position adjustment unit integrates the adjustment mechanism directly into the support unit structure, eliminating the need for separate connecting fittings. The support unit itself provides both support and adjustment functions, reducing component count while maintaining assembly capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The support unit serves multiple functions: it supports the head module, provides mounting position adjustment, and enables precise positioning. This multi-functional design replaces what would otherwise require separate components for each function.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Ease of manufacture

If connecting fittings are used to connect head modules, then the head modules can be assembled, but mounting time increases

Engineering Contradiction:
Improvehead module assemblyVSAvoidmounting time
Core Design Contradiction:
Ease of manufactureVSLoss of time

Solution Approach 1:

The adjustment mechanism is integrated into the support unit, allowing adjustment to occur during the mounting process itself rather than requiring a separate adjustment step after assembly with connecting fittings.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The mounting position adjustment unit is pre-configured on the support unit, so that positioning adjustments can be made immediately when the head module is mounted, eliminating time-consuming post-assembly adjustments.

Inventive Principle:
Principle #10Preliminary action

3Manufacturing precision

If convex portions and concave portions are processed with high accuracy for positioning, then head modules can be precisely positioned, but manufacturing complexity increases

Engineering Contradiction:
Improvehead module positioning accuracyVSAvoidprocessing complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces complex mechanical fitting systems (convex-concave portions requiring high precision machining) with a support unit-based positioning system that achieves precise positioning through structural design rather than high-precision machining of mating surfaces.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The support unit acts as an intermediary between the base frame and head modules, providing a standardized interface that simplifies the positioning requirement. Instead of requiring high-precision convex-concave fittings between head modules, the support unit mediates the positioning through its mounting mechanism.

Inventive Principle:
Principle #24Intermediary (Mediator)

4Ease of manufacture

If head modules are connected through fittings, then assembly is possible, but thermal expansion effects propagate to other head modules

Engineering Contradiction:
Improvehead module connectionVSAvoidposition stability under thermal expansion
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

Each head module is independently mounted on its own support unit, which is attached to the base frame. This segmentation isolates thermal expansion effects to individual head modules rather than allowing them to propagate through connecting fittings to adjacent modules.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The support unit serves as an intermediary that decouples head modules from each other. Instead of direct connection through fittings that transmit thermal effects, each head module connects to the base frame through its own support unit, which acts as an isolating intermediary.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentEP2905137B1Droplet-discharging head, image-forming device, and method for positioning head modules of droplet-discharging head
Publication Date: 2017.08.09 FUJIFILM CORP
  • EP2905137B1 patent drawingFigure 1
  • EP2905137B1 patent drawingFigure 2
  • EP2905137B1 patent drawingFigure 3

AI summary

Provided are a droplet-discharging head, a droplet-discharging device, and a method for positioning head modules of the droplet-discharging head in which the job of adjusting head module installation positions can be easily performed. In an ink jet head 200 configured by linking multiple head modules 210 together, each head modules 210 is mounted on a base frame 212 supported by a head module support unit provided on the base frame 212. The mounting positions of the head modules 210 in an X-direction mounted on the base frame 212 are individually adjusted by X-directional mounting position adjustment unit. The amounts of displacement of the head modules 210 here are detected by displacement detection unit.