Inkjet Head Partition Wall Width Optimization
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Solution Overview
Problem
The existing inkjet head technologies face challenges in achieving reliable joining between the fluid channel substrate and the supporting substrate, which hinders downsizing and increases crosstalk between individual liquid chambers, affecting the stiffness and processing accuracy of the fluid channel substrate.
Innovation Solution
The inkjet head design includes a fluid channel substrate with individual liquid chambers partitioned by walls, an oscillation plate with laminated electrodes and piezoelectric elements, and a supporting substrate with concave oscillation chambers, where the supporting substrate partition walls are narrower than the liquid chamber partition walls and wider than the wiring layer patterns, enhancing joining reliability and facilitating downsizing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a supporting substrate is joined with the fluid channel substrate to improve stiffness and reduce crosstalk, then the joining reliability is improved, but the layer structure height difference causes bonding strength reduction and requires larger joining area
Solution Approach 1:
The supporting substrate partition walls are designed with a specific width that is narrower than the liquid chamber partition walls but wider than the wiring layer patterns. This local dimensional variation optimizes the joining area by providing sufficient bonding surface while maintaining alignment tolerance, thereby improving joining reliability without requiring excessive joining area that would increase device complexity
Solution Approach 2:
The invention changes the width parameter of the supporting substrate partition walls to a specific range (narrower than liquid chamber partition walls but wider than wiring layer patterns). This parameter optimization resolves the contradiction by providing an ideal joining area size that ensures both bonding strength and alignment tolerance, improving joining reliability while avoiding excessive complexity
2Manufacturing precision
If the width of supporting substrate partition walls is reduced to improve alignment tolerance, then positioning accuracy is improved, but the joining area is reduced which may affect bonding strength
Solution Approach 1:
The supporting substrate partition walls are designed with a specific local width that balances two opposing requirements: narrow enough to provide alignment tolerance (improving manufacturing precision) but wide enough to maintain sufficient bonding area (preserving bonding strength). This local dimensional optimization resolves the contradiction between alignment tolerance and bonding strength
Solution Approach 2:
The width parameter of the supporting substrate partition walls is optimized to a specific range that simultaneously satisfies alignment tolerance requirements and bonding strength requirements. By changing this parameter to an optimal value, the invention resolves the contradiction between manufacturing precision and bonding strength
3Volume of moving object
If the fluid channel substrate thickness is reduced to enable downsizing, then the head size is reduced, but the stiffness and processing accuracy deteriorate
Solution Approach 1:
The invention uses a composite structure consisting of the fluid channel substrate and the supporting substrate joined together. This composite structure provides the necessary stiffness and processing accuracy that would be difficult to achieve with a thin fluid channel substrate alone, while still enabling downsizing of the overall head assembly
Solution Approach 2:
The invention addresses the stiffness problem by adding a supporting substrate in another dimension (the thickness direction). Instead of increasing the fluid channel substrate thickness, the solution introduces an additional structural layer that provides mechanical support, enabling downsizing while maintaining processing accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the joining reliability between the fluid channel and supporting substrates, reduces crosstalk, and enables more compact inkjet head designs while maintaining stable ink discharging characteristics.
Implementation Method 1
a piezoelectric element method and an electrostatic method have been known
Data Source
AI summary
Disclosed is an inkjet head including a fluid channel substrate on which individual liquid chambers are arranged, the individual liquid chambers being partitioned by liquid chamber partition walls; an oscillation plate that is formed on a surface facing openings of nozzles; actuators; wiring layer patterns that supplies driving signals to the actuators, the wiring layer patterns being formed above the corresponding liquid chamber partition walls; and a supporting substrate in which concave oscillation chambers are formed, the concave oscillation chambers being partitioned by supporting substrate partition walls. A width in the short direction of the supporting substrate partition wall is smaller than a width in the short direction of the liquid chamber partition wall and greater than a width of the wiring layer pattern.