Inkjet Head Driving Circuit Board Area Reduction via Piezo Side Input
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Solution Overview
Problem
The existing manufacturing methods for ink jet recording heads result in enlarged driving circuit boards due to the need for both a driving circuit and input portions, leading to increased costs and reduced material efficiency.
Innovation Solution
A manufacturing method that reduces the size of the driving circuit board by using piezo elements with individual and common electrodes, piezoelectric layers, and strategically placed bumps and through holes to facilitate electrical connections, allowing for a more compact design and high-density ink discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the driving circuit board is enlarged to accommodate both the driving circuit and input portion, then the input portion can be provided on the board, but the size of the driving circuit board increases and cost increases
Solution Approach 1:
The patent relocates the input portion from the plane of the driving circuit board to the side surface of the piezo element. This dimensional transition allows the input portion to be positioned in three-dimensional space rather than constrained to the two-dimensional board surface, enabling signal input functionality without increasing board area.
Solution Approach 2:
The input portion is integrated into the side surface of the piezo element, effectively nesting the input functionality within the existing piezo element structure. This eliminates the need for separate input portion space on the driving circuit board while maintaining full functionality.
2Ease of operation
If the driving circuit board is enlarged, then the driving circuit and input unit areas are secured, but the number of boards obtained from one raw material decreases and cost increases
Solution Approach 1:
By moving the input portion to the side surface of the piezo element (three-dimensional positioning), the patent reduces the two-dimensional footprint required on the driving circuit board. This allows more boards to be cut from a single raw material while maintaining all necessary functional areas.
Solution Approach 2:
The patent combines the input portion with the piezo element structure, merging two previously separate functional elements into one integrated component. This reduces the total area required on the driving circuit board and improves manufacturing efficiency.
3Device complexity
If the driving circuit is disposed face down in the holding portion, then the driving circuit is protected and compact, but the input portion must be provided on the driving circuit board enlarging its size
Solution Approach 1:
The patent resolves the conflict between face-down compact arrangement and input portion placement by moving the input portion to the side surface of the piezo element. This three-dimensional repositioning allows the driving circuit to remain face down in the compact holding portion while the input portion accesses signals from a different spatial location, eliminating the need to enlarge the board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of smaller, more cost-effective ink jet recording heads capable of high-density ink discharge by reducing the size of the driving circuit board and simplifying the manufacturing process while maintaining reliable electrical connections.
Implementation Method 1
A piezo ink jet system is an on-demand type ink jet printing system which discharges a liquid droplet by deforming a piezo element through the applying of a voltage to the piezo element
Data Source
AI summary
A manufacturing method of a head which includes a channel formation substrate having two piezoelectric actuator rows formed thereon, a driving circuit, and a driving circuit board which is provided with a first bump and a second bump. In the method, a piezo element is formed and the first bump is formed on the outside of the piezoelectric actuator row, on the driving circuit board, an adhesive layer is provided on both sides of the first bump and the second bump, a first through hole and a second through hole are formed on the driving circuit board, a first connection wiring and a second connection wiring which are connected to the driving circuit are formed, and a first electrode of the piezoelectric actuator is electrically connected to the first connection wiring via the first bump and a second electrode is electrically connected to the second connection wiring via the second bump.