Ink Jet Recording Head Chip Pilot Hole Etching
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Solution Overview
Problem
Existing ink jet recording head manufacturing methods face challenges in producing chips with narrower, more precise, and efficiently manufactured ink delivery channels, as they are limited by mask design and etching processes, leading to inaccuracies and longer production times.
Innovation Solution
The method involves forming pilot holes by laser on a silicon substrate, followed by anisotropic etching to create '<>'-shaped ink delivery channels, allowing for precise control of channel width and depth, reducing production time, and enabling mass production of narrower channels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If dry etching is used to form narrow common ink delivery channels, then channel width precision is improved, but production time increases significantly
Solution Approach 1:
The patent forms pilot holes at predetermined positions and depths before the main etching process. These pilot holes serve as guides for the anisotropic etching, allowing the etchant to penetrate to the correct depth and create the desired '<>' shape. This preliminary action eliminates the need for deep dry etching, thereby reducing production time while maintaining precision.
Solution Approach 2:
The patent replaces the mechanical dry etching process with a chemical anisotropic etching process guided by pilot holes. Instead of using physical sputtering or ion bombardment to remove material, the method uses chemical etchants that selectively remove silicon along crystal planes, achieving precise channel formation more efficiently.
2Length of moving object
If mask opening width is reduced to create narrower channels, then channel width is decreased, but manufacturing complexity and time increase
Solution Approach 1:
The patent divides the channel formation process into two independent stages: first forming pilot holes at predetermined positions, then performing anisotropic etching to create the final channel shape. This segmentation allows the mask design to focus only on pilot hole positioning rather than defining the entire channel geometry, simplifying mask design while enabling narrower channels.
Solution Approach 2:
The patent changes the etching parameters by using anisotropic etching with controlled depth and angle, rather than relying solely on mask opening dimensions. The channel width is determined by the etching process parameters (etchant concentration, temperature, time) and pilot hole positioning, rather than by mask opening width, allowing for more precise and simpler channel formation.
3Device complexity
If anisotropic etching is performed without pilot holes, then process simplicity is maintained, but channel depth control and precision deteriorate
Solution Approach 1:
The patent introduces pilot holes as a preliminary step before anisotropic etching. These pilot holes are formed at predetermined positions and depths, serving as guides that control the etching process. The pilot holes ensure that the anisotropic etching starts at the correct location and proceeds to the desired depth, achieving precise channel formation without complicating the overall process.
Solution Approach 2:
The pilot holes act as an intermediary element between the mask and the final channel structure. They mediate the transfer of geometric information from the mask to the channel, ensuring accurate positioning and depth control. The pilot holes are temporary structures that facilitate precise etching but are not part of the final channel, allowing for simple yet precise process design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the reliable and efficient mass-production of ink jet recording head chips with narrower, more precise ink delivery channels, improving manufacturing efficiency and accuracy compared to prior methods.
Implementation Method 1
forming pilot holes by laser on a silicon substrate
Implementation Method 2
followed by anisotropic etching to create '<>'-shaped ink delivery channels
Data Source
AI summary
A manufacturing method for a substrate for an ink jet head, including formation of an ink supply port in a silicon substrate, the method includes a step of forming, on one side of the substrate, an etching mask layer having an opening at a position corresponding ink supply port; a step of forming unpenetrated holes through the opening of the etching mask layer in at least two rows in a longitudinal direction of the opening; and a step of forming the ink supply port by crystal anisotropic etching of the substrate in the opening.