Inkjet Head Cooling Pipe Embedding for Gap-Free Heat Transfer

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Solution Overview

Problem

The configuration of sandwiching a cooling pipe between a pair of cooling plates in liquid jet heads can lead to gaps, reducing heat transfer efficiency and increasing the risk of misalignment and deformation during molding.

Innovation Solution

Embedding at least a part of the cooling pipe within a cooling member with higher thermal conductivity, featuring recessed parts and insert molding to prevent gaps and ensure effective heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a cooling pipe is sandwiched between a pair of cooling plates, then the structure is simple and easy to manufacture, but gaps occur between the cooling pipe and cooling plates, reducing heat transfer efficiency

Engineering Contradiction:
Improveease of manufactureVSAvoidheat transfer efficiency
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The cooling pipe and cooling plate are merged into a single integrated component through insert molding. The cooling pipe is inserted into the mold cavity before injecting the cooling plate material, creating a seamless bond that eliminates gaps and ensures efficient heat transfer while maintaining manufacturing simplicity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The cooling pipe is nested within the cooling plate structure. The cooling pipe is positioned inside the mold cavity and surrounded by the cooling plate material during injection, creating a nested configuration where the cooling pipe is embedded within the cooling plate for optimal thermal contact

Inventive Principle:
Principle #7Nested doll (Nesting)

2Device complexity

If a cooling pipe is sandwiched between cooling plates, then the structure is simple, but misalignment and deformation occur during molding

Engineering Contradiction:
Improvedevice complexityVSAvoidmanufacturing precision
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The cooling pipe is pre-positioned and secured in the correct location within the mold cavity before the cooling plate material is injected. This preliminary positioning action ensures proper alignment is established before the molding process begins, preventing misalignment and deformation

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

A support structure or positioning fixture acts as an intermediary between the cooling pipe and the mold walls during the molding process. This intermediary element maintains the cooling pipe's position and prevents deformation caused by mold closing forces

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of manufacture

If gaps occur between cooling pipe and cooling plates, then assembly is simple, but heat transfer efficiency decreases

Engineering Contradiction:
Improveease of assemblyVSAvoidheat transfer efficiency
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The mechanical assembly of separate cooling pipe and cooling plate components is replaced with a molded integration process. The insert molding technique creates a permanent mechanical bond that eliminates gaps without requiring complex assembly operations, substituting the assembly mechanism with a manufacturing process

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances cooling efficiency by facilitating heat transfer from the cooling pipe to the cooling member, reduces misalignment and deformation during molding, and prevents burrs, while maintaining corrosion resistance.

Implementation Method 1

the gap is difficult to occur between the cooling pipe and the cooling member, and therefore, it becomes easy to transfer the heat from the cooling pipe to the cooling member

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12539710B2Liquid jet head, liquid jet recording device, and method of manufacturing liquid jet head
Publication Date: 2026.02.03 SII PRINTEK INC
  • US12539710B2 patent drawing
  • US12539710B2 patent drawing
  • US12539710B2 patent drawing

AI summary

A cooling efficiency is increased. An inkjet head is provided with a head main body for jetting ink, a cooling pipe which has corrosion resistance to the ink, and through which the ink for cooling a drive circuit passes, and a cooling member which has higher thermal conductivity than that of the cooling pipe, in which at least a part of the cooling pipe is embedded, and which has recessed parts in at least a part of a portion surrounding the cooling pipe.