Ink-jet Recording Head Substrate Alignment via Sealant Curing Measurement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Long ink-jet recording heads with high-density nozzle arrays face challenges in maintaining accurate nozzle position alignment due to substrate warping and reduced yield during manufacturing, leading to deviations that affect image quality.
Innovation Solution
A method involving the application of sealants to recording element substrates and a supporting member, followed by precise measurement and adjustment of substrate positions based on distance differences before and after sealant curing, ensures accurate alignment and positioning of nozzles in the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the length of the recording element substrate is increased to achieve a longer recording width, then the recording width is improved, but the substrate becomes more susceptible to cracks and warping
Solution Approach 1:
The recording head is divided into multiple recording element substrates, each with a manageable length that avoids warping and cracking issues. These substrates are arranged in series on a single integral carrier to achieve the desired long recording width without compromising substrate reliability.
2Quantity of substance
If multiple recording element substrates are arranged on an integral carrier to achieve high-density nozzle arrays, then the recording width and nozzle density are improved, but the accuracy of nozzle position alignment deteriorates due to substrate warping
Solution Approach 1:
Positional deviation of nozzles is measured in advance during the manufacturing process, and correction data is stored. This preliminary measurement and data storage enable subsequent correction of alignment errors without requiring physical repositioning during final assembly.
Solution Approach 2:
The system changes the parameter of nozzle position by using stored correction data to adjust the effective position coordinates. This allows the nozzle positions to be corrected through parameter modification rather than physical adjustment, maintaining manufacturing precision despite substrate warping.
3Manufacturing precision
If photolithography is used to form nozzles with high accuracy, then the nozzle positioning precision is improved, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent replaces complex mechanical alignment and positioning systems with a data-based correction approach. By measuring positional deviations and storing correction data, the system substitutes elaborate mechanical adjustment mechanisms with simpler measurement and data processing, reducing manufacturing complexity while maintaining high precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the accurate arrangement of recording element substrates after manufacturing, preventing gaps and overlaps in printed images and achieving high-definition recording with reduced positional deviations, thus enhancing the quality and reliability of long ink-jet recording heads.
Implementation Method 1
curing the applied sealants by heating and cooling the sealants
Data Source
AI summary
In a method of manufacturing an ink-jet recording head including plural recording element substrates having at least one nozzle array comprising nozzles to eject ink, an electric wiring member supplying signals to the recording element substrates, a member supporting the recording element substrates and the electric wiring member, electric connecting portions electrically interconnecting the recording element substrates and the electric wiring member, and a sealant sealing the electric connecting portions, the method comprises the steps of applying sealants to the supporting member including the recording element substrates, the electric wiring member, and the electric connecting portions, and curing the sealants, measuring a distance between reference positions set on each recording element substrate before and after the curing of the sealants, and mounting the recording element substrates to the supporting member depending on a difference in the distance between the reference positions measured before and after the curing of the sealants.