Inkjet Plane Patterns for Flat Panel Displays
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Solution Overview
Problem
In the manufacturing of flat panel display devices, such as liquid crystal and organic EL displays, the inkjet method for forming plane patterns often results in abnormal patterns due to internal pressure differences and surface energy instability, leading to manufacturing instability and potential defects.
Innovation Solution
The formation of plane patterns is optimized by minimizing internal pressure differences and surface area, using specific combinations of shapes and designs, such as comb tooth patterns, circular cut patterns, and chamfering, to ensure consistent internal pressure and reduced surface energy across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the inkjet method is used to form plane patterns, then the throughput can be improved and cost can be reduced, but abnormal patterns occur due to internal pressure differences and surface energy instability
Solution Approach 1:
The patent changes the geometric parameters of the plane patterns (adding circular cutouts, modifying shapes) to reduce surface area and minimize internal pressure differences during inkjet formation. This allows the inkjet method to maintain both high throughput and pattern accuracy by optimizing the physical parameters of the patterns themselves.
Solution Approach 2:
The patent segments continuous plane patterns by introducing circular cutouts and dividing them into smaller shape elements. This segmentation reduces the overall surface area and creates multiple smaller regions with more uniform internal pressure distribution, preventing abnormal pattern formation while maintaining the functional integrity of the wiring patterns.
2Manufacturing precision
If complex pattern shapes are used to reduce internal pressure differences, then manufacturing precision improves, but device complexity increases
Solution Approach 1:
The patent applies local quality modifications by introducing circular cutouts specifically at strategic locations within the plane patterns. Rather than redesigning entire patterns, it locally modifies specific regions to reduce surface area and internal pressure differences, achieving pattern consistency without overwhelming complexity.
Solution Approach 2:
The patent introduces circular cutouts with curved boundaries into the plane patterns. These curved, spherical-like features help distribute internal pressure more evenly and reduce surface tension effects compared to sharp corners or straight edges, improving pattern formation stability while adding only moderate geometric complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the occurrence of abnormal patterns, enhancing manufacturing stability and enabling the production of high-quality, low-cost display devices with precise wiring patterns.
Implementation Method 1
an inkjet apparatus or the like... ink of a solvent mixed with metal is ejected only to portions where the wiring patterns should be formed
Implementation Method 2
After that, the solvent is evaporated by heat applied thereto, and sintering is performed
Implementation Method 3
the liquid flows to make its internal pressure constant and reduce its surface area, so that plane patterns are changed... Just after the ink lands on the substrate, the ink shows behavior like liquid due to a solvent included therein
Data Source
AI summary
A substrate with plane patterns formed in a liquid process wherein the plane patterns are formed based on a combination of plane shapes by which a difference in internal pressure of a solution between any two points of the solution is small, the solution being ejected onto the substrate so as to form the plane patterns by the liquid process.