Inkjet Printed Double-Sided PCB Fabrication
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Solution Overview
Problem
Current methods for fabricating printed circuit boards (PCBs) are limited by the need for complex processes such as etching and soldering, which hinder miniaturization and integration, particularly for multi-layered and double-sided boards, due to the requirement for drilling and wide soldering areas.
Innovation Solution
The use of inkjet printing with a system comprising a first and second print head, along with a conveyor, to form conductive and insulating layers on a removable substrate, followed by curing and removal to create a flat, continuous surface, utilizing ink compositions that include metal nanoparticles and porous particulates with embedded monomers and cross-linking agents to form reinforced thermoset boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional lithography and etching methods are used to fabricate PCBs, then conductive lines can be formed, but the process becomes complex and time-consuming, hindering miniaturization and integration
Solution Approach 1:
The patent replaces traditional mechanical lithography and etching processes with inkjet printing technology. The inkjet system deposits conductive ink directly onto the substrate to form circuit patterns, eliminating the need for photoresist coating, photolithography exposure, and chemical etching. This substitution of mechanical/chemical processes with a direct digital printing approach simplifies the fabrication process and improves productivity.
Solution Approach 2:
The invention changes the fundamental parameters of the fabrication process by using inkjet printing with specific ink formulations (conductive ink containing metal particles, binder, and solvent) that can be directly deposited and cured to form functional conductive traces. This parameter change from subtractive etching to additive printing reduces process steps and complexity.
2Length of moving object
If drilling and soldering are performed to adhere elements to PCBs, then electrical connections are established, but wider areas are required limiting miniaturization
Solution Approach 1:
The patent merges the circuit trace formation and element connection functions into a single integrated process. The inkjet system prints conductive traces that directly connect to component pads, eliminating the separate drilling and soldering operations. This integration allows for smaller connection areas and improved miniaturization while maintaining precise electrical connections.
Solution Approach 2:
The invention extracts the connection function from the traditional drilling/soldering process and integrates it into the printing process itself. The conductive ink serves dual purposes: forming circuit traces and providing electrical connection to components, thereby eliminating the need for separate mechanical drilling and thermal soldering operations that require larger areas.
3Adaptability or versatility
If multi-layered PCBs are fabricated using traditional methods, then complex circuits are achieved, but complicated processes including drilling, laminating, and soldering are required
Solution Approach 1:
The patent segments the multi-layer PCB fabrication into independent printing stages. Each layer can be printed separately using the inkjet system, with conductive ink deposited on each layer to form the required circuit patterns. This segmentation allows complex multi-layer circuits to be built up layer by layer without requiring traditional drilling and lamination processes, simplifying the overall fabrication process while achieving high circuit complexity.
4Strength
If soldering is performed to adhere elements, then elements are fixed to the PCB, but a wider area than the elements themselves is required
Solution Approach 1:
The invention applies local quality by concentrating the conductive ink material precisely where connections are needed, rather than using broad soldering areas. The inkjet system deposits material only in the specific locations required for electrical connection and mechanical support, reducing the connection area to match the element size while maintaining adequate adhesion strength through the localized conductive ink formulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient and precise fabrication of complex PCBs with improved miniaturization and integration capabilities, reducing the need for extensive drilling and soldering, and allowing for the formation of multi-layered and double-sided boards with enhanced electrical properties.
Implementation Method 1
using an ink jet printing system, forming a conductive circuit pattern on the removable substrate
Implementation Method 2
wherein the monomer, oligomer, polymer or their combination that is operably coupled to the porous particulates are entirely embedded within the particulates and configured to leach out of the porous particulate at a temperature of between about 60° C. and about 150° C.
Implementation Method 3
exposing the continuous phase to electromagnetic radiation configured to initiate radical formation in the multifunctional acrylate monomers, oligomers, polymers or their combination; and reacting the monomer, oligomer or their combination from the porous particulates with the cross-linking agent and the radicalized multifunctional acrylate monomers, oligomers, polymers or their combination
Implementation Method 4
curing the first circuit pattern
Data Source
AI summary
The disclosure relates to methods, kits and compositions for direct printing of double-sided and/or multilayered printed circuit boards. Specifically, the disclosure relates to the printing of conductive leads and insulating portions of printed circuit boards using inkjet printing.