3D Inkjet Printed Traces for Transverse Substrate Connections
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Solution Overview
Problem
Current methods for connecting integrated circuit dies to printed circuit boards, such as wire bonding and solder balls, are limited in their ability to efficiently and accurately form conductive connections between complexly oriented substrates, particularly in three-dimensional configurations.
Innovation Solution
The use of inkjet printing with conductive ink to create three-dimensional conductive traces that connect electrical contacts on substrates, allowing for flexible and precise attachment of dies to substrates with varying orientations, using a printhead capable of multi-axis displacement and rotation to ensure continuous and reliable trace formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If wire bonding or solder balls are used to connect IC dies to PCBs, then electrical connections are established, but the ability to efficiently and accurately form conductive connections between complexly oriented substrates in three-dimensional configurations is limited
Solution Approach 1:
The patent transitions from traditional two-dimensional planar connections to three-dimensional spatial connections by using a robotic dispensing system with multi-axis movement capability. This allows conductive material to be deposited along complex three-dimensional paths between substrates mounted at various orientations, enabling connections in vertical, diagonal, and multi-level configurations that were not feasible with conventional wire bonding or solder ball methods.
Solution Approach 2:
The patent replaces the mechanical processes of wire bonding (wire manipulation and bonding) and solder ball formation (reflow soldering) with a robotic dispensing system that precisely deposits conductive material. This substitution eliminates the need for complex mechanical bonding operations and enables more flexible routing patterns through programmable multi-axis motion control.
2Manufacturing precision
If traditional connection methods are used, then electrical connections are formed, but precision and accuracy in forming conductive connections are limited
Solution Approach 1:
The robotic dispensing system serves multiple functions: it positions substrates, routes conductive material along complex paths, and forms precise connections between contact points. This multi-functional system replaces multiple specialized processes (wire bonding, soldering, alignment) with a single integrated platform that achieves high precision through programmable motion control and real-time positioning.
3Volume of moving object
If substrates are mounted in stacked configurations, then space is efficiently utilized, but forming continuous conductive traces without gaps becomes more difficult
Solution Approach 1:
The robotic dispensing system employs dynamic multi-axis movement to adapt to the three-dimensional spatial relationships between stacked substrates. The system continuously adjusts its position and orientation to maintain precise control over conductive material deposition, ensuring continuous trace formation even when substrates are vertically stacked or mounted at various angles. This dynamic positioning capability allows the system to bridge gaps between contact points on different substrate levels.
Data Source
AI summary
One method of making an electronic assembly includes mounting one electrical substrate on another electrical substrate with a face surface on the one substrate oriented transversely of a face surface of the other substrate. The method also includes inkjet printing on the face surfaces a conductive trace that connects an electrical contact on the one substrate with an electrical connector on the other substrate. An electronic assembly may include a first substrate having a generally flat surface with a first plurality of electrical contacts thereon; a second substrate having a generally flat surface with a second plurality of electrical contacts thereon, the surface of the second substrate extending transversely of the surface of said first substrate; and at least one continuous conductive ink trace electrically connecting at least one of the first plurality of electrical contacts with at least one of the second plurality of electrical contacts.