Inkjet Printhead Backside Electrical Connection
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Solution Overview
Problem
Existing inkjet printheads face challenges in maintaining print quality and facilitating maintenance due to wirebond connections that protrude from the ink ejection face, affecting the planarity of the printhead and preventing effective hydrophobic coatings.
Innovation Solution
The implementation of a printhead assembly with backside electrical connections using a connector film sandwiched between the ink supply manifold and printhead integrated circuits, eliminating the need for wirebond connections on the frontside and allowing for a fully planar ink ejection face, which is coated with a hydrophobic polymer layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wirebond connections are used to connect printhead integrated circuits to power/data supply, then electrical connections are established, but the wirebonds protrude from the ink ejection face and affect print maintenance and print quality
Solution Approach 1:
The patent inverts the conventional location of electrical connections from the front side (ink ejection face) to the back side of the printhead integrated circuit. The connector film is positioned on the backside, sandwiched between the ink supply manifold and the printhead IC, eliminating protruding wirebonds from the ink ejection face while maintaining electrical connectivity through the substrate.
2Ease of manufacture
If wirebond connections are used, then power and data can be supplied to printhead integrated circuits, but the frontside face cannot be fully planar and hydrophobic coatings are prevented
Solution Approach 1:
The patent moves the electrical connection interface from the front surface dimension to the back surface dimension of the printhead IC. The connector film extends from the backside through the substrate, allowing electrical connections to be established in a different spatial dimension that does not interfere with the planarity requirements of the ink ejection face.
Data Source
AI summary
An inkjet printhead assembly comprising an ink supply manifold; printhead integrated circuits and a connector film for supplying power to drive circuitry in the printhead integrated circuits. Each printhead integrated circuit has a frontside comprising the drive circuitry and inkjet nozzle assemblies, a backside attached to the ink supply manifold, and ink supply channels providing fluid communication between the backside and the inkjet nozzle assemblies. A connection end of the connector film is sandwiched between part of the ink supply manifold and the printhead integrated circuits.