Inkjet Printhead Single-Edge Bonding Cost Reduction
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Solution Overview
Problem
Inkjet printing technologies face challenges in providing reliable and cost-effective inkjet pens due to high costs associated with the purchase of inkjet pens, which can discourage consumers.
Innovation Solution
The design of an inkjet pen with a printhead die and flex circuit assembly that uses Tape Automated Bonding (TAB) and single-edge fluid delivery, reducing material costs and substrate size, while maintaining efficient fluid ejection and electrical connectivity through integrated circuitry and conductive traces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional printhead designs with multiple bonding edges are used, then reliable fluid delivery and electrical connectivity are achieved, but manufacturing cost and substrate size increase
Solution Approach 1:
The printhead substrate is divided into distinct functional regions: a fluid delivery region with nozzles and a separate electronics region with circuitry. This segmentation allows single-edge bonding to suffice, as fluid delivery and electrical connectivity are spatially separated, reducing manufacturing cost while maintaining reliability
Solution Approach 2:
The patent transitions from traditional multi-edge bonding configurations to single-edge bonding by reorganizing the spatial arrangement of components. All critical connections are concentrated at one edge of the substrate, utilizing dimensional reconfiguration to simplify the bonding process and reduce costs
2Ease of manufacture
If larger substrates are used to accommodate all components, then component placement and connectivity are simplified, but material usage and substrate cracking risk increase
Solution Approach 1:
The layout of components is reorganized from a distributed arrangement requiring large substrate area to a compact arrangement at one edge. This dimensional reconfiguration allows all necessary components to be placed in a concentrated manner, reducing material usage while maintaining ease of manufacture
Solution Approach 2:
Multiple functional elements are merged into a compact configuration at a single edge of the substrate. The fluid delivery structures, electrical contacts, and support features are integrated in a space-efficient manner, reducing overall substrate size and material consumption
3Ease of manufacture
If single-edge bonding is used to reduce cost, then manufacturing cost and substrate size decrease, but achieving reliable fluid delivery becomes more difficult
Solution Approach 1:
The substrate is segmented into dedicated fluid delivery structures at one edge, separate from electronics. This segmentation allows precise control of fluid delivery pathways and nozzles at the bonding edge, maintaining manufacturing precision while enabling cost-effective single-edge bonding
Solution Approach 2:
Intermediary structures such as manifolds, channels, and transition pieces are incorporated at the bonding edge to facilitate reliable fluid delivery. These intermediary elements ensure precise fluid control despite the simplified single-edge bonding configuration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a more cost-effective inkjet pen with improved reliability and reduced substrate size, minimizing material usage and substrate cracking, while maintaining high print resolution and efficient fluid delivery.
Implementation Method 1
a heating element formed on a first surface of the substrate, the integrated circuitry comprising a drive transistor formed in the substrate and coupled to the heating element
Data Source
AI summary
Embodiments of a printhead are disclosed.